Staff Engineer, Project Management (iBGA R&D)

Role Summary

UTAC is seeking an experienced and driven Staff Engineer,Project Management to lead Image Sensor automotive package and process development projects within our Corporate iBGA R&D team. This role is instrumental in supporting image sensor, iBGA technology development, AEC-Q100 qualification activities, and new material initiatives while managing key customer programs, particularly for China-based customers.

The successful candidate will drive project execution, lead cross-functional teams, and serve as the technical focal point between customers, suppliers, and internal stakeholders to ensure successful product development and AEC-Q100 qualification.

Responsibilities

• Lead R&D projects from concept through qualification and mass production transfer.

• Manage Image Sensor automotive new package and process development activities using structured methodologies such as AEC-Q100, APQP and NPI.

• Coordinate customer engineering builds,qualification programs, and material development projects.

• Translate customer requirements, specifications, and technical expectations into actionable development plans and internal work instructions.

• Drive process improvement, packaging innovation, and low-cost material qualification initiatives.

• Monitor project schedules, risks, deliverables, and milestones to ensure successful execution.

• Support reliability investigations, failure analysis, and root cause determination for image sensor and advanced packaging technologies.

• Collaborate with customers, suppliers, external laboratories, and cross-functional teams to achieve project objectives.

• Contribute to technology innovation,intellectual property generation, and patent development.

• Establish and drive R&D KPIs aligned with customer and business objectives

Requirements

• Bachelor's Degree in Engineering, Material Science, Mechanical Engineering, Electrical & Electronic Engineering, or a related discipline.
• Minimum 5 years of relevant experience in semiconductor package, process, or product development within the semiconductor manufacturing or OSAT industry.
• Proven experience managing cross-functional projects from development through qualification and production ramp-up.
• Hands-on experience in New Product Introduction (NPI), package/process development, APQP, PFMEA, DFMEA, 8D problem solving, AEC-Q100 reliability qualification, and failure analysis.
• Experience in Image Sensor BGA (iBGA), MEMS, camera module assembly, advanced packaging, or related semiconductor technologies will be an advantage.
• Strong project management, stakeholder management, and technical leadership capabilities.
• Demonstrated analytical, problem-solving, and decision-making skills, with the ability to manage multiple priorities in a fast-paced environment.
• Effective communication and interpersonal skills, with the ability to collaborate with customers, suppliers, and cross-functional teams globally.
• Familiarity with engineering and quality tools such as DOE, SPC, MSA, FMEA, Six Sigma, Microsoft Project, and AutoCAD will be advantageous.
• Strong proficiency in English and Mandarin (spoken and written), complemented by effective presentation and communication skills, is required as the role regularly interacts with customers, suppliers, and business stakeholders in China to facilitate technical discussions, deliver presentations, coordinate projects, and support business communications.
• Willingness to travel within Singapore and overseas, as required by the role.

Skills

Process Improvement and Optimisation, Liaising with cross functional teams, Leadership, Innovation and Change, Technical Project Management, Material Qualification, Plan Development, Cross Functional Project Management, Stakeholder Engagement, Priority Management, delivery milestones, Packaging Engineering, Presentation Skills, Customer Service, Collaboration With Stakeholders, Stakeholder Management, Technical Project Delivery, New Product Development, Semiconductor Technology