Principal Packaging Engineer

Velaura • 2 months ago
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Salary
$200k – $300k per year
Location
In office (Santa Clara)
Seniority
Principal
Employment
Full-Time

Confirmed on the employer's own hiring board on Sep 26, 2026. First seen by Alion on Jul 15, 2026.

Overview
Company
Impact
Profile match

Velaura

Velaura AI, Inc., formerly Auradine, builds ultra-low-power compute solutions for data center, edge, and physical AI applications.
velaura.ai • HQ: Campbell, United States • 201-500 employees
Tech stack of Velaura

Role Overview

We are looking for a Principal Packaging Engineer to own package architecture and development for Velaura’s next-generation SoCs. This role will lead packaging from concept through production, working across silicon, board, system, thermal, mechanical, and manufacturing teams to deliver high-performance, cost-effective, and manufacturable products. The ideal candidate has deep experience with advanced semiconductor packaging, package-level signal and power integrity, substrate and assembly technologies, and cross-functional system optimization.

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