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Staff Engineer-Lead frame & Package Design

Wolfspeed • Semiconductor Manufacturing • Analog & Power Semiconductors • 11 hours ago
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Salary
≈ $19k – $43k per year (Estimated)
Location
In office (Ipoh)
Seniority
Staff · 5+ years exp
Employment
Full-Time

Confirmed on the employer's own hiring board on Sep 30, 2026. First seen by Alion on Sep 30, 2026. Wolfspeed scores B on the Alion truth index.

Overview
Company
Impact
Profile match

Wolfspeed

Wolfspeed manufactures silicon carbide materials and power semiconductors. Its devices improve efficiency in electric vehicles, industrial drives and renewable energy systems. The company operates large domestic wafer and device fabrication plants.
wolfspeed.com • HQ: Durham, United States • Semiconductor Manufacturing • Analog & Power Semiconductors • 1001-5000 employees • Est. 1987
Tech stack of Wolfspeed
  • Performs design-generation and reviews for new packages or platforms which includes component , sub-assembly and Package Outline for new platforms and new devices
  • Ensures that the appropriate documents are in place for all new & existing design changes in PDM
  • Participate in Assembly & Test Design Rules, Design of Manufacturing (DFM) and Feasibility studies which includes mechanical stack-up tolerancing to ensure an design is optimised for cost and manufacturability
  • Maintenance & revision of Design rules to ensure they are up to date taking into account Suppliers, equipment & Customer capabilities and requirements respectively.
  • Knowledge of semiconductor Assembly/Test manufacturing and FEA simulation is an advantage
  • Performs other functions as may be assigned from time to time by superior.

Job Specification

  • Education/Knowledge: University graduate, preferably of an Engineering course with knowledge in mechanical design(2D &3D) Software
  • Skills: Excellent Computer skills
  • Work Experience: At least 5 to 8 years in same/related field, with AutoCAD experience especially in Semiconductor Packaging & Lead frame design
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