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Salary
≈ $147k – $279k per year (Estimated)
Location
In office (Santa Clara)
Seniority
Architect · 10+ years exp

Confirmed on the employer's own hiring board on Oct 19, 2026. First seen by Alion on Jul 30, 2026.

Overview
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Impact
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Xscape Photonics is a silicon photonics company spun out of Columbia University that has developed a scalable multi-color laser platform for the bandwidth bottlenecks between GPUs and memory in AI hardware. It hires photonics packaging, optical engine, link architecture, module, NPI and firmware engineers. The company is headquartered in New York, United States.

Job Title: Principal Optical Engine (OE) / Link Architect

About the Role

We are seeking a highly experienced and visionary Principal Optical Engine (OE) Architect to lead the technical definition and architectural of Optical link design of our next-generation optical products. In this critical role, you will be responsible for defining an OCI-MSA (Optical Compute Interconnect - Multi-Source Agreement) ready Optical Engine  

Working in lockstep with Product Management, you will take the Market Requirements Document (MRD) and translate those market needs into a highly detailed, actionable Product Requirements Document (PRD). You will leverage your deep expertise in end-to-end optical link architecture, Photonic Integrated Circuits (PIC), and Electronic Integrated Circuits (EIC) to architect solutions that push the boundaries of high-speed optical interconnects.

Key Responsibilities

  • PRD Generation & Ownership: Collaborate directly with Product Management (who drives the MRD) to develop, refine, and own the comprehensive Product Requirements Document (PRD) for our next-generation Optical Engines.
  • Transceiver System Architecture: Architect complete optical transceiver sub-systems. Balance optical, electrical, thermal, and mechanical parameters to meet stringent power, performance, and cost targets for OCI-MSA compliance.
  • End-to-End Link Architecture: Define and manage the end-to-end optical link budget. Model optical impairments (e.g., dispersion, noise, crosstalk, penalties), define Forward Error Correction (FEC) requirements, and ensure robust signal integrity across the link.
  • PIC & EIC Integration: Lead the system-level architecture bridging Photonic Integrated Circuits (PIC) and Electronic Integrated Circuits (EIC), heavily optimizing the interaction between DSPs, TIAs, Modulator Drivers, and optical components.
  • Modulation & Signal Integrity: Drive architectural decisions regarding high-speed modulation formats (e.g., PAM4, Coherent) and collaborate with SI/PI teams to ensure the electrical interfaces meet high-speed compliance standards.
  • Standards & Ecosystem Leadership: Ensure product alignment with current and emerging OCI and MSA standards. Act as a technical representative for the company within relevant industry consortia.
  • Trade-off Analysis: Conduct rigorous technical and cost trade-off analyses for different OE architectures, packaging technologies, component selections, and link budget allocations.

Required Qualifications & Experience

  • Experience: 10+ years of proven industry experience functioning as a Transceiver Architect, Link Architect, or Principal Optical System Architect.
  • Industry Pedigree: Previous experience at tier-1 semiconductor or optical networking companies is highly preferred (e.g., Intel, Broadcom, Marvell, Cisco, or similar industry leaders).
  • Core Domain Expertise: Deep, hands-on architectural knowledge of both PIC (Photonic Integrated Circuits) and EIC (Electronic Integrated Circuits).
  • Proven track record in optical transceiver design (e.g., OSFP, QSFP-DD, or Co-Packaged Optics).
  • Mastery of link budgeting, optical penalty modeling, and FEC trade-offs for high-speed datacom/telecom links.
  • Standards Knowledge: Familiarity with the Optical Compute Interconnect (OCI) ecosystem and experience developing products aligned with Multi-Source Agreements (MSAs).
  • Product Definition Skills: Demonstrated capability to write highly detailed PRDs and translate high-level market requirements (MRDs) into strict, actionable technical specifications for engineering teams.
  • Education: MS or Ph.D. in Electrical Engineering, Photonics, Physics, or a related field.

Preferred Skills

  • Experience with advanced 2.5D/3D packaging technologies (e.g., TSV, micro-bumping, flip-chip) relevant to modern Optical Engines.
  • Strong understanding of thermal challenges in high-density, co-packaged, or pluggable optical interconnects.
  • Excellent communication skills with the ability to articulate complex link-level technical concepts to cross-functional engineering teams and business stakeholders.
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