Winbond Electronics
winbond.com
Actively hiring
Semiconductor Manufacturing
Memory & Storage Chips
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News
Winbond Electronics Corporation, 2344:TAI summary - FT.com
Latest Winbond Electronics Corporation (2344:TAI) share price with interactive charts, historical prices, comparative analysis, forecasts, business profile and more.
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Winbond Electronics and Transcend report strong growth as memory shortage
Memory chip manufacturers Winbond Electronics and Transcend Information posted significant profit increases in late 2025, driven by heightened demand and ongoing supply constraints in the memory sector. Both companies recorded record revenues and raised c
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Winbond Electronics (TWSE:2344) Price Target Increased by 73.14% to 51.51
The average one-year price target for Winbond Electronics (TWSE:2344) has been revised to NT$51.51 / share. This is an increase of 73.14% from the prior estimate of NT$29.75 dated September 27, 2025. The price target is an average of many targets provided
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Winbond Electronics Corp.
The Nature Index tracks the affiliations of scientific articles from high-quality publications. The research profile for Winbond Electronics Corp. reflects the research output of authors from Winbond Electronics Corp. who published articles in the 145 jou
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Winbond Electronics and Secure-IC in Partnership for Embedded Cybersecurity
Design And Reuse - Catalog of IP Cores and Silicon on Chip solutions for IoT, Automotive, Security, RISC-V, AI, ... and Asic Design Platforms and Resources
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Rambus (RMBS), Winbond Electronics Enter into License Deal
Rambus Inc. (RMBS) has signed a patent licensing agreement with Winbond Electronics Corporation for an undisclosed sum.
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Tech stack
Technologies named in job postings at Winbond Electronics over the last 12 months, by layer, with the share of postings for each.
Technologies in use
118
Postings analysed
68
Stack modernity
87/100AI adopter
Languages
Python35%
SQL25%
C#24%
JavaScript13%
Frameworks & libraries
PoC Library7%
Angular6%
PyTorch4%
ASP.NET Core4%
Databases
MS SQL7%
MySQL4%
Apache Iceberg1%
Cassandra1%
Cloud & platforms
Azure18%
.NET13%
Linux13%
GitHub Actions10%
AI & ML
LLM13%
ChatGPT7%
Gemma7%
Claude6%
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Full Winbond Electronics tech stack
118 technologies · by team · pay by technology · changes · similar stacks
Growth
Hiring Momentum
78/100
Scaling fast
Open positions
181
39 opened / 12 closed in 30 days
Median time-to-fill
26 days
faster than 46% of the market
ATS activity
Every ~8 hours
Today
Hiring Dynamics
+100%
Hiring Focus
The percentage next to each role is its share of the company's job openings over the last 90 days; the arrow shows the shift versus the previous period.
Industrial Engineering
43% ▼
Hardware
14% ▲
DevOps
6%
QA
5%
Operations
5% ▼
Backend
4% ▲
Actively hiring for Industrial Engineering (+43 in 30 days)
Activity Timeline
New location: Taiwan
Oct 2026
Added UML to stack
Oct 2026
Added Agile to stack
Oct 2026
Added VPN to stack
Oct 2026
New location: Tel Aviv
Sep 2026
Added SystemVerilog to stack
Sep 2026
Added ElasticSearch to stack
Sep 2026
Added Apache Kafka to stack
Sep 2026
Added Windows Server to stack
Sep 2026
Added Hyper-V to stack
Sep 2026
Added Active Directory to stack
Sep 2026
Added TensorFlow C++ to stack
Sep 2026
Offices
Where the company hires and what each office is for
Cities
5
Hiring now
5
Countries
2
Busiest office
Taichung
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Headquarters
Builds here
Office with open vacancies
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Taichung
Taiwan
HQ
45 open roles 46 posted in 90 days 36% engineering 500-1000 est. staff
hires for Industrial Engineering, Hardware, HR
Hsinchu
Taiwan
Regional office
72 open roles 83 posted in 90 days 64% engineering 1000-5000 est. staff
hires for Hardware, Backend, Management
Kaohsiung
Taiwan
Plant / site
62 open roles 66 posted in 90 days 11% engineering 500-1000 est. staff
hires for Industrial Engineering, Hardware, DevOps
Tel Aviv
Israel
Engineering / R&D
4 open roles 4 posted in 90 days 75% engineering 50-200 est. staff
hires for Hardware, Security, Industrial Engineering
Tainan
Taiwan
1 open roles 1 posted in 90 days 100% engineering 10-50 est. staff
hires for Hardware
Jobs
≈ $11k – $27k per year (Estimated) • In office • 1+ year exp • Taichung
JavaScript
TypeScript
SQL
C#
ASP.NET Core
Frontend
Angular
DevOps
Git
Management
UML
Apply
≈ $22k – $48k per year (Estimated) • In office • 10+ years exp • Hsinchu
Agile
Scrum
Apply
≈ $15k – $41k per year (Estimated) • In office • 3+ years exp • Hsinchu
Confluence
Jira
Agile
Scrum
Apply
≈ $17k – $41k per year (Estimated) • In office • 5+ years exp • Hsinchu
C#
.NET
DevOps
Azure
VPN
Apply
≈ $14k – $37k per year (Estimated) • In office • 3+ years exp • Hsinchu
Python
SQL
Databricks
Analytics
Power BI
ETL/ELT
Apply
≈ $12k – $29k per year (Estimated) • In office • 2+ years exp • Hsinchu
JavaScript
SQL
C#
ASP.NET Core
DevOps
GCP
Azure
Git
AWS
Apply
≈ $14k – $29k per year (Estimated) • In office • Hsinchu
Python
Qwen
LoRA
vLLM
Gemma
Fine-tuning
Quantization
AI Agents
AWQ
GGUF
TensorRT
Ollama
PEFT
TensorRT-LLM
LLM
RAG
SFT
DevOps
SLURM
GitHub
Linux
Apply
≈ $23k – $51k per year (Estimated) • In office • 5+ years exp • Hsinchu
CI/CD
GitHub
Apply
≈ $15k – $34k per year (Estimated) • In office • 1+ year exp • Hsinchu
Verilog
C
U-Boot
DevOps
Linux
Unix
Apply
≈ $18k – $46k per year (Estimated) • In office • 5+ years exp • Hsinchu
Python
Databricks
Microsoft Fabric
AI/ML
RAG
DevOps
GCP
Azure
AWS
Chips/EDA
PoC Library
Analytics
ETL/ELT
Apply
≈ $12k – $27k per year (Estimated) • In office • Taichung
JavaScript
C#
Apply
Apply