半导体测试工程师
JOB SUMMARY
The purpose of the job is to lead the design and execution of automation engineering projects in the area of expertise, e.g., mechanical, electrical, electronics, software application. The Lead Automation Design Engineer leads and oversees the work of a team of design engineers to ensure project requirements, specification, plan, design and installation are achieved. Position is responsible for design of automation equipment to ensure stipulated specification and requirements are met, and delivered within budget and on time. Position supports Senior Manager of Automation in design of automation equipment.
ESSENTIAL DUTIES AND RESPONSIBILITIES
· Leads and oversees the work of a group of Automation Design Engineers.
· Reviews and approves design drawings, user manual and installation manual.
· Works closely with Project Manager/Engineer to meet project time line and budget.
· Leads the team in review, understanding and interpretation of requirements to ensure all specifications are integrated into the design of automation equipment.
· Leads design engineers in review of design and manufacturability of design.
· Ensures all engineering times are logged into JP2 and correspondent to the projects
· May perform other duties and responsibilities as assigned.
JOB QUALIFICATIONS
KNOWLEDGE REQUIREMENTS
· Expert knowledge in the mechanical/electronics/electrical/software application engineering.
· Expert knowledge in the EMS industries.
· Expert knowledge in automation design and installation.
EDUCATION & EXPERIENCE REQUIREMENTS
· B.Sc. in Mechanical or Electronics/Electrical Engineering
· Minimum 8-10 years of working experiences in automation equipment design and installation
· Or an equivalent combination of education, training or experience.
任职资质
1. 大专及以上学历。
2.熟悉半导体CP测试流程，掌握ATE测试原理，有长川/华峰设备实操经验优先。
3.可独立编写自动化测试脚本，看懂芯片规格书，熟悉功率、模拟类芯片测试指标
4. 具备客户现场调试、故障排查能力，能接受短期出差驻场。
5. 沟通顺畅，抗压性强，有晶圆厂、封测厂、半导体设备厂商工作经历优先。
岗位职责
1.基于长川D9000、华峰STS系列ATE设备，开发芯片自动化测试程序，搭建晶圆CP全自动测试流程。
2.驻客户现场完成测试机、探针台、分选机联动调试，跟进新机试产与量产爬坡
3.优化自动化测试流程，改善测试良率、机台稼动率，排查产线各类测试异常。
4.负责SiC、IGBT、模拟SoC、存储芯片等器件测试方案落地与设备验证。
5.输出测试SOP、技术文档，为客户产线人员提供自动化操作培训与技术支持
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