Senior IC packaging engineer, IC package technologies

Annapurna Labs is a semiconductor company established by semiconductor industry veterans and is now part of Amazon Web Services (AWS).

We are developing leading edge products, manufactured on leading edge technologies.

We offer a dynamic, open, teamwork environment operating at high pace mode.

Key job responsibilities

- Assume full ownership of mechanical and thermal design of Annapurna ICs.

- Engage with product architect and design teams on future products package and assembly needs

- Perform package level thermal simulations.

- Perform package level mechanical simulations.

- Lead and design thermal and mechanical measurements of ICs.

- Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurna’s products.

- Engage with substrate and assembly vendors on future technologies roadmap.

- In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.

- Ensure testability of the ICs in collaboration with Test Engineer team.

About the team

Diverse Experiences

AWS values diverse experiences. Even if you do not meet all of the qualifications and skills listed in the job description, we encourage candidates to apply. If your career is just starting, hasn’t followed a traditional path, or includes alternative experiences, don’t let it stop you from applying.

Why AWS?

Amazon Web Services (AWS) is the world’s most comprehensive and broadly adopted cloud platform. We pioneered cloud computing and never stopped innovating - that’s why customers from the most successful startups to Global 500 companies trust our robust suite of products and services to power their businesses.

Inclusive Team Culture

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Work/Life Balance

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Basic qualifications

- Experience developing products for volume production

- Experience delivering products to volume production

- Bachelor's degree in Electrical Engineering or a related field

- Bachelor's degree or above in mechanical engineering, electrical engineering, material science, physics or equivalent, or experience applying theoretical models in an applied environment

Preferred qualifications

- Master's degree or Ph.D. degree in Electrical Engineering or related field

- Experience in microelectronics packaging (either wire-bonding or flip chip)

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