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Salary
≈ $115k – $217k per year (Estimated)
Location
In office (Secaucus)
Seniority
Senior
Visa
No sponsorship (stated in the posting)

Confirmed on the employer's own hiring board on Nov 6, 2026. First seen by Alion on Aug 18, 2026. AMD scores A on the Alion truth index.

Overview
Company
Impact
Profile match

AMD

AMD is an American semiconductor company founded in 1969 and headquartered in Santa Clara, California, that designs processors, graphics chips and adaptive computing hardware without owning fabrication plants. Its Ryzen and Threadripper processors and Radeon graphics serve consumers and creators, EPYC server chips have taken a large share of the data centre market from Intel, and the Instinct accelerators compete for AI training and inference workloads. The 2022 acquisition of Xilinx added field-programmable gate arrays and adaptive systems on chip, and the company also supplies the custom silicon inside the PlayStation and Xbox consoles.

WHAT YOU DO AT AMD CHANGES EVERYTHING

At AMD, our mission is to build great products that accelerate next-generation computing experiences-from AI and data centers, to PCs, gamingand embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuityand a shared passion to create something extraordinary. When you join AMD, you’lldiscover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges-striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.Together, we advance your career.

THE ROLE:

Join AMD’s Data Center Platform Engineering Group (DPEG) Thermal Mechanical Engineering team and help shape the cooling technologies behind next-generation Data Center GPU products. In this highly collaborative, hands-on environment, you will work with silicon, package, board, power, validation, manufacturing, and external partner teams to transform product requirements into high-performance, reliable, and scalable thermal solutions.

This role offers the opportunity to work across the full product lifecycle, from early concept and computational modeling through cold-plate development, laboratory validation, and production. You will deepen your expertise in advanced liquid cooling, electronics thermal management, and GPU platform design while contributing to one of AMD’s most strategic growth areas.

THE PERSON:

You are a technically curious and collaborative engineer who enjoys solving complex thermal challenges and turning analysis into practical product solutions. You communicate clearly across engineering disciplines, balance multiple priorities, and are comfortable working directly with internal teams and external vendors. You bring strong ownership, sound engineering judgment, attention to detail, and a willingness to learn new tools and cooling technologies in a fast-paced product-development environment.

KEY RESPONSIBILITIES:

  • Design and develop thermal solutions for next-generation AMD Data Center GPU products, with an emphasis on liquid cooling and cold-plate technologies.

  • Build and analyze thermal and CFD models using tools such as ANSYS Icepak, AEDT, or equivalent, and translate results into actionable design recommendations.

  • Partner with silicon, package, board, power, mechanical, validation, manufacturing, and vendor teams to deliver chip-, card-, and system-level thermal-mechanical solutions.

  • Support thermal characterization and hands-on laboratory validation, including correlation of simulation results with physical test data and resolution of performance gaps.

  • Drive thermal design activities across the product lifecycle, from initialrequirements and concept development through qualification and production readiness.

  • Evaluate emerging cooling technologies, components, and supplier capabilities to support future product roadmaps and scalable data center solutions.

  • Within the first 90 days, learnthe team’s tools, products, and development processes and begin contributing to simulation, design, or validation activities.

  • Within the first year, independently own thermal deliverables for an assigned product or project and contribute to team knowledge sharing and mentoring.

PREFERRED EXPERIENCE:

  • Strong foundationin heat transfer, fluid dynamics, and electronicscooling.

  • Experience with computational fluid dynamics and thermal-analysis tools such as ANSYS Icepak, AEDT, Fluent, or equivalent. Candidates with strong fundamentals and experience using comparable tools are encouraged to apply.

  • Knowledge of air- and liquid-cooling technologies, including cold plates and thermal management for high-power electronics.

  • Familiarity with thermal-management components such as thermal interface materials, heat sinks, vapor chambers, heat pipes, fans, and liquid distribution systems.

  • Experience with GPU, server, rack, data center, semiconductor, or other high-performance electronics thermal design is desired.

  • Hands-on thermal laboratory testing, instrumentation, data analysis, and simulation-to-test correlation experience.

  • Familiarity with CAD tools such as Creo or SolidWorks and scripting or analysis tools such as Python, MATLAB, C, or C++ is a plus.

  • Experience collaborating with cross-functional engineering teams and external vendors or suppliers.

ACADEMIC CREDENTIALS:

  • BS, MS, or PhD in Mechanical Engineering, Aerospace Engineering, Thermal Engineering, or a related engineering discipline is preferred.

LOCATION: Secaucus, New Jersey. (Onsite)

This role is not eligible for visa sponsorship.

#LI-CS1

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

THE ROLE:

Join AMD’s Data Center Platform Engineering Group (DPEG) Thermal Mechanical Engineering team and help shape the cooling technologies behind next-generation Data Center GPU products. In this highly collaborative, hands-on environment, you will work with silicon, package, board, power, validation, manufacturing, and external partner teams to transform product requirements into high-performance, reliable, and scalable thermal solutions.

This role offers the opportunity to work across the full product lifecycle, from early concept and computational modeling through cold-plate development, laboratory validation, and production. You will deepen your expertise in advanced liquid cooling, electronics thermal management, and GPU platform design while contributing to one of AMD’s most strategic growth areas.

THE PERSON:

You are a technically curious and collaborative engineer who enjoys solving complex thermal challenges and turning analysis into practical product solutions. You communicate clearly across engineering disciplines, balance multiple priorities, and are comfortable working directly with internal teams and external vendors. You bring strong ownership, sound engineering judgment, attention to detail, and a willingness to learn new tools and cooling technologies in a fast-paced product-development environment.

KEY RESPONSIBILITIES:

  • Design and develop thermal solutions for next-generation AMD Data Center GPU products, with an emphasis on liquid cooling and cold-plate technologies.

  • Build and analyze thermal and CFD models using tools such as ANSYS Icepak, AEDT, or equivalent, and translate results into actionable design recommendations.

  • Partner with silicon, package, board, power, mechanical, validation, manufacturing, and vendor teams to deliver chip-, card-, and system-level thermal-mechanical solutions.

  • Support thermal characterization and hands-on laboratory validation, including correlation of simulation results with physical test data and resolution of performance gaps.

  • Drive thermal design activities across the product lifecycle, from initialrequirements and concept development through qualification and production readiness.

  • Evaluate emerging cooling technologies, components, and supplier capabilities to support future product roadmaps and scalable data center solutions.

  • Within the first 90 days, learnthe team’s tools, products, and development processes and begin contributing to simulation, design, or validation activities.

  • Within the first year, independently own thermal deliverables for an assigned product or project and contribute to team knowledge sharing and mentoring.

PREFERRED EXPERIENCE:

  • Strong foundationin heat transfer, fluid dynamics, and electronicscooling.

  • Experience with computational fluid dynamics and thermal-analysis tools such as ANSYS Icepak, AEDT, Fluent, or equivalent. Candidates with strong fundamentals and experience using comparable tools are encouraged to apply.

  • Knowledge of air- and liquid-cooling technologies, including cold plates and thermal management for high-power electronics.

  • Familiarity with thermal-management components such as thermal interface materials, heat sinks, vapor chambers, heat pipes, fans, and liquid distribution systems.

  • Experience with GPU, server, rack, data center, semiconductor, or other high-performance electronics thermal design is desired.

  • Hands-on thermal laboratory testing, instrumentation, data analysis, and simulation-to-test correlation experience.

  • Familiarity with CAD tools such as Creo or SolidWorks and scripting or analysis tools such as Python, MATLAB, C, or C++ is a plus.

  • Experience collaborating with cross-functional engineering teams and external vendors or suppliers.

ACADEMIC CREDENTIALS:

  • BS, MS, or PhD in Mechanical Engineering, Aerospace Engineering, Thermal Engineering, or a related engineering discipline is preferred.

LOCATION: Secaucus, New Jersey. (Onsite)

This role is not eligible for visa sponsorship.

#LI-CS1

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

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