Process Development Senior Engineer (Die Attach / Wire Bond)

ams OSRAM · Consumer Electronics · Hardware · Master's Degree · 30 days ago
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Salary
≈ $21k – $42k per year (Estimated)
Location
In office (Bayan Lepas)
Seniority
Senior

Confirmed on the employer's own hiring board on Nov 3, 2026. First seen by Alion on Oct 5, 2026. ams OSRAM scores A on the Alion truth index.

Overview
Company
Impact
Profile match

ams OSRAM

ams OSRAM is an Austrian semiconductor company headquartered in Premstaetten near Graz. It designs optical sensors, emitters and lighting components used in smartphones, cars and medical devices. The group was formed when ams acquired the German lighting company OSRAM and is listed on the SIX Swiss Exchange.
ams-osram.com · HQ: Premstätten, Austria · LED Lighting & Luminaires · Sensors & Transducers · Optics & Photonic Components · 1001-5000 employees · Est. 1981
Tech stack of ams OSRAM
  • Develop or optimize Die Attach and Wire Bond processes for new product development project to meet project cost, quality and timeline targets.
  • Participate and support FOL processes tehcnology roadmap and building block activities.
  • Equipment selection which meet project cost, quality and timeline target.
  • Share and transfer technical know how within R&D and to Manufacturing team.
  • Provide technical guidance or job coaching to junior supporting staff
  • Participate in engineering sample, pre-series and ramp-up build to fulfill customer order.

What we look for

  • Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent.
  • 2-3 years in semiconductor field especially in Die Attach and Wire Bond processes.
  • Process egnineering knowledge in semiconductors or LED manufacturing processes.
  • Knowledge in process development step and statistic.
  • B. Minitab knowledge will be advantage.
  • Six Sigma Green or Black Belt will be advantage.

Please contact Nurul Ain Rosli for further information via [email protected] or +60 (4) 3053200.

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