Process Integrator Advanced Packaging & Co-Packaged Optics R&D

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Advanced Packaging & Co-Packaged Optics R&D

Albany, New York

Position Summary

We are seeking an experienced Process Integrator to lead development and integration of advanced semiconductor packaging modules in an R&D environment. This role will connect unit processes, materials, device requirements, metrology, reliability, and equipment capabilities into robust integrated flows. The successful candidate will work across Applied Materials business units, external partners, and customers to convert complex technical objectives into executable integration plans, learning cycles, and differentiated solutions. Experience in co-packaged optics (CPO), photonics packaging, or optical/electrical heterogeneous integration is strongly preferred.

Key Responsibilities

• Own end-to-end process integration for advanced packaging and heterogeneous integration programs, from initial concept and architecture through demonstration and technology transfer.

• Develop integrated process flows for photonic integrated circuits, electronic ICs, optical engines, interposers, substrates, and fiber interfaces, including module sequences, process windows, control plans, and learning-cycle strategies.

• Translate optical, electrical, thermal, mechanical, reliability, and manufacturability requirements into process-integration specifications and measurable success criteria for CPO modules.

• Lead cross-functional execution across photonics, device, packaging, bonding, lithography, deposition, etch, clean, CMP, plating, metrology, optical test, electrical test, failure analysis, modeling, and reliability teams.

• Drive integration of photonic and electronic die, including die-to-wafer or wafer-to-wafer bonding, fine-pitch interconnects, optical coupling and alignment, fiber attach interfaces, and advanced substrate or interposer integration.

• Design and execute structured experiments and DOEs to optimize optical loss, coupling efficiency, alignment tolerance, interconnect performance, thermal behavior, defectivity, yield, and reliability.

• Integrate laser, modulator, detector, waveguide, electronic IC, thermal-management, and package-level requirements into stable module and full-flow performance.

• Identify and resolve CPO integration risks such as contamination, bonding defects, overlay and alignment error, warpage, thermal-mechanical stress, optical-interface degradation, and process-induced device shifts.

• Create CPO technology roadmaps, integration reviews, risk assessments, schedules, and executive-ready reports; communicate clearly with engineers, senior leaders, customers, research partners, and suppliers.

• Identify invention opportunities, contribute to intellectual property, and establish disciplined R&D practices for CPO integration, data quality, documentation, and technical decision-making.

Leadership Profile for E6

• Recognized technical authority who applies broad integration expertise to solve unique and complex problems.

• Leads programs with significant technical risk and organizational complexity; defines strategy and influences execution across functions.

• Anticipates objections, aligns stakeholders, and persuades senior technical and business leaders using data and sound engineering judgment.

• Balances deep technical ownership with practical program execution, customer impact, and development of others.

Work Location & Travel

Location: Albany, New York. This is an on-site R&D role requiring close collaboration with laboratory, fab, metrology, and integration teams.

Travel: Periodic domestic and international travel may be required to support customers, partners, and cross-site teams.

Required Qualifications

• MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Applied Physics, Photonics, or a related technical field.

• 5-10 years of experience in a semiconductor process integrator or process-integration role, with substantial experience in R&D or advanced technology development.

• Demonstrated experience building and executing integrated semiconductor or photonics process flows involving multiple process modules and cross-functional engineering teams.

• Strong understanding of CPO, silicon photonics, photonic integrated circuits, optical engines, or optical/electrical heterogeneous integration.

• Working knowledge of photonic and electronic die integration, optical coupling and alignment, fiber attach interfaces, fine-pitch interconnects, and advanced substrate or interposer integration.

• Understanding of optical loss, alignment tolerances, thermal management, thermal-mechanical interactions, packaging-induced stress, defect mechanisms, metrology, characterization, and reliability.

• Experience planning experiments, applying statistical analysis and DOE methods, interpreting optical, electrical, physical, and reliability datasets, and converting results into clear technical decisions.

• Proven ability to lead technically complex R&D projects with ambiguity, risk, and interdependencies while maintaining execution discipline.

• Self-directed, collaborative, and comfortable working in a fast-paced global R&D organization.

• Excellent written and verbal communication skills, including the ability to explain complex CPO integration issues to diverse technical and executive audiences.

Preferred Qualifications

• Direct experience with co-packaged optics (CPO), silicon photonics, photonic integrated circuits, optical engines, or optical/electrical heterogeneous integration.

• Experience with advanced packaging technologies such as 2.5D/3D integration, hybrid or fusion bonding, die-to-wafer or wafer-to-wafer integration, TSVs, fine-pitch interconnects, chiplets, advanced substrates, interposers, or wafer-level packaging.

• Knowledge of optical alignment, coupling, packaging tolerances, optical loss, thermal-mechanical interactions, or photonics test and characterization.

• Experience interfacing with customers, research consortia, universities, suppliers, or ecosystem partners on emerging technology programs.

• A record of patents, publications, invited presentations, or technical leadership in semiconductor integration, advanced packaging, or photonics.

Additional Information

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The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

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