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Salary
≈ $55k – $117k per year (Estimated)
Location
In office (Singapore)
Seniority
Principal
Employment
Full-Time

Confirmed on the employer's own hiring board on Oct 3, 2026. First seen by Alion on Aug 30, 2026. GlobalFoundries scores B on the Alion truth index.

Overview
Company
Impact
Profile match
GlobalFoundries is a semiconductor foundry headquartered in Malta, New York, near Albany, that manufactures chips for other companies on FD-SOI, FinFET, RF, silicon germanium, silicon photonics, power and GaN process technologies, and also offers MIPS processor designs. Founded in 2009 and listed on Nasdaq, it runs fabs in New York, Vermont, Dresden and Singapore with engineering and design centres in Austin, Santa Clara, Bengaluru and Penang. It hires process, equipment, yield and tapeout engineers, maintenance technicians and apprentices, field application engineers and interns in engineering and finance.

About GF

GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI atscale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power efficient and high-performance solutions for high growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remainsfocused every day on security, longevity, and sustainability. For more information, visit www.gf.com.

Introduction

GlobalFoundries Singapore is seeking highly skilled and motivated Experienced Equipment Engineer to become part of our starting 300mm Advance Packaging Center, Singapore.

The Diffusion Process Engineer position reports directly to a functional area module manager in Giga Fab in Singapore.

The primary responsibilities of this position are to develop and/or optimize unit processes to set up Advance Packaging related process (bond & Debond, pre-bond - Plasma / UV / cleaning process, Die re-constitution, annealing & TSV ) on multi-stack bond wafer / Die-to-Wafer process (on wafer level or frame Form Carrier level),do troubleshooting for process and tool issues. Additionally, the candidate will be expected to assist in tooling start-up, installing the processes into manufacturing, and owning the processes and the tools in manufacturing.

Job Responsibilities:

  • Designing, executing, and analyzing experiments to develop advanced packaging etch processes to meet technology (e.g. performance, yield, and reliability) and manufacturing (e.g. process stability, cost of ownership) targets.

  • Startup and qualify new process and new equipment within scheduled timeline. Work closely with Equipment Engineer on new equipment acceptance and tool matching. Understand the concept of repeatability and reproducibility (R&R) run.

  • Improve process robustness for high volume manufacturing using statistical tools, DOE techniques, data driven decision making and systematic problem-solving skills. Use lean manufacturing and six sigma processes.

  • To work closely with equipment team to improve equipment productivity indices

  • Resolve complex technical issues in own Module or yield related issues.

  • Support the Integration team and Quality organization to ensure technology meet the qualification and reliability requirements.

  • Sustain and improve process / SPC to meet quality, cost, productivity requirements

  • To coach and develop other engineers on advance packaging Etch processes knowledge.

  • Facilitate/ initiate CIP programs to optimize process window, cost, yield, and productivity. Establish plans and strategies to optimize process capability to meet operational requirements

  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

  • Related manufacturing and development experience is requested.

Required Qualifications:

  • BS degree or Master's Degree or PhD in Electrical Engineering, Chemical Engineering, Science, Solid State Physics or other relevant engineering physical science discipline is required

  • Relevant working experience in Bonder (TEL W2W/ BESI D2W), die re-constitution & Annealing (TEL Alpha 303, mattson- helios) process tool.

  • Excellent verbal and written communication skills.

  • Strong interpersonal skills and ability to work effectively with different cultures.

GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiencyand innovation whilst our employees feel truly respected, valuedand heard.

As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.

All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.

No Recruitment Fee Policy: GlobalFoundries is committed to ethical and transparent hiring practices.Candidates will not be charged any fees at any stage of the recruitment process. Any request for payment related to a GlobalFoundries employment opportunity is unauthorized and should be reported immediately. All legitimate recruitment communications are conducted exclusively through official GlobalFoundries channels. To report concerns or suspected recruitment fraud, please contact our Ethics & Compliance Office at [email protected] or visit our official website.

The Ethics & Compliance mailbox is not a recruitment channel. CVs/resumes submittedto this mailbox will not be reviewed, processed, or considered for employment opportunities. Please apply through the official GlobalFoundries careers site only.

Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia

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