Design Lead
Confirmed on the employer's own hiring board on Nov 7, 2026. First seen by Alion on Nov 5, 2026.
Job Summary
The Mechanical Engineer - Core Design plays a key role in the design and development of semiconductor equipment, mechanical modules, sheet-metal structures, precision assemblies, and complex subsystems. The role requires strong expertise in UG NX, GD&T, Sheet Metal, Tolerance Stack-up, Semiconductor Fabrication Processes, Material Selection, SOM, and FEA (Structural & Thermal). This engineer will lead concept creation, detailed design, validation, and cross-functional collaboration to deliver high-quality mechanical solutions. Preferred SEMI Domain
Key Responsibilities
Core Mechanical Design: Create detailed 3D models and assemblies using UG NX, develop innovative concepts, apply DFM/DFA principles, and conduct trade-off analysis.
GD&T & Tolerance Engineering: Apply ASME Y14.5 standards, conduct 2D/3D tolerance stack-ups, and validate critical tolerances.
Sheet Metal & Machined Component Design: Design enclosures, brackets, frames, and apply sheet-metal design rules including bend allowances and manufacturability.
Semiconductor Fabrication Process Knowledge: Understand vacuum design, plasma interaction, thermal loads, contamination control, and process module interfaces.
Material Selection & SOM: Select materials based on mechanical, thermal, chemical, and vacuum criteria; develop SOM documentation and risk analysis.
FEA - Structural & Thermal: Perform structural/thermal analysis, evaluate static/dynamic loads, perform modal studies, and validate heat dissipation.
Cross-Functional Collaboration: Work with electrical, systems, manufacturing, supply chain, and reliability teams; drive design reviews.
Testing, Validation & Release: Support prototype builds, perform functional testing, implement ECOs, and release designs through PLM tools.
Skill Requirements
UG NX (Expert Level)
GD&T (ASME Y14.5)
Sheet Metal Design and Drafting
Tolerance Stack-up (Worst Case & Statistical)
Semiconductor Fabrication Process Knowledge
Material Selection for Vacuum & Cleanroom Applications
Classification: Internal
Structural & Thermal FEA (ANSYS/Abaqus)
SOM Documentation Knowledge
DFM/DFA Application
PLM Tools (Teamcenter/Windchill)
Strong communication and presentation abilities.
Ability to lead technical discussions and decisions.
Analytical problem-solving and root-cause analysis capability.
Mentorship experience with junior engineers.
Other Requirements
4. Education
Bachelor’s or master’s degree in mechanical engineering or related field.
5. Experience Range
7-10 years of hands-on experience in mechanical design engineering, preferably in semiconductor equipment, high-tech capital machinery, robotics, or precision systems