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Salary
≈ $26k – $53k per year (Estimated)
Location
In office (India)
Seniority
Staff · 10+ years exp

Confirmed on the employer's own hiring board on Oct 23, 2026. First seen by Alion on Oct 23, 2026.

Overview
Company
Impact
Profile match
HCLTech is a major Indian multinational information technology (IT) services and consulting company headquartered in Noida, Uttar Pradesh. Spun off from the original HCL Group in 1991, it ranks as one of India's largest technology companies alongside firms like TCS, Infosys, and Wipro.

Job Summary

We are seeking a highly collaborative and structured Technical Program Manager (TPM) for Physical Design to drive the execution, scheduling, and delivery of our next-generation, high-performance SoCs. In this role, you will be the core driver keeping the RTL-to-GDSII physical implementation timeline on track. You will combine your technical VLSI background with program management methodologies to manage cross-functional dependencies, identify bottlenecks, mitigate tape-out risks, and communicate milestone health to executive leadership.

Key Responsibilities

  • Define, build, and execute the end-to-end program plan for full-chip physical implementation, spanning early synthesis, floorplanning, PnR, CTS, timing closure, sign-off, and final GDSII delivery.
  • Coordinate and track critical dependencies across upstream and downstream teams, including RTL Front-End, Design Verification (DV), DFT, Package Design, Signal/Power Integrity, and Foundry partners.
  • Proactively identify technical, resource, or schedule bottlenecks (e.g., late RTL drops, timing closure stalls, EMIR or DRC hotspots). Drive engineering teams to build concrete recovery plans.
  • Orchestrate milestone reviews (e.g., Netlist Ready, Floorplan Freeze, Tape-out Sign-off Reviews) to ensure all entry and exit criteria are rigorously met.
  • Translate highly complex technical layouts, layout bugs, and timing closure metrics into clear, high-level status dashboards and execution updates for executive stakeholders.
  • Continuously evaluate and refine the physical design execution flow. Implement agile tracking systems, retrospective frameworks, and automation hooks to accelerate future tape-out cycles.

Skill Requirements

  • 10+ years of total experience in the semiconductor industry, with a minimum of 3+ years acting as a TPM or Engineering Lead specifically handling digital physical design .
  • Strong working knowledge of the digital implementation flow (Synthesis, PnR, CTS, STA/Timing Closure, Physical Verification, and EMIR). You must be able to understand technical discussions with engineers and question resource limitations.
  • Expert proficiency in program tracking suites such as Jira, Confluence, Microsoft Project, Smartsheet, or equivalent Agile/Waterfall frameworks.

Other Requirements

  • PMP (Project Management Professional) or Agile/Scrum certification is a plus, provided it is backed by deep VLSI engineering experience.
  • Outstanding interpersonal and conflict-resolution skills, with a proven ability to influence engineering teams across multiple geographic sites without direct authority.
  • Experience managing high-pressure environments during final tape-out crunch phases.
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