MEMS Fab Process Development Engineer (Dry Etch)

Description -

What a Dry Etch Process Engineer does in HP include:

• Own and sustain dry etch processes for silicon and oxide etching modules to support high-volume manufacturing and new product introduction (NPI).
• Drive process optimization, defect reduction, yield improvement, and process robustness through data analysis, DOE, and continuous improvement projects.
• Investigate process excursions, yield loss, and defectivity issues using structured problem-solving methodologies, and implement effective corrective and preventive actions.
• Develop and maintain process control plans, SPC monitoring, OCAPs, specifications, and process documentation.
• Collaborate closely with equipment engineers to resolve process-related equipment issues and establish effective process monitoring strategies.
• Lead process characterization, qualification, and release activities for new products, materials, consumables, and process changes.
• Support process transfer, technology development, and process integration activities across engineering and manufacturing teams.
• Analyze process performance data and drive improvements in critical process metrics, including yield, defectivity, process capability, and throughput.
• Work closely with cross-functional teams including Process Integration, Manufacturing, Equipment Engineering, Quality, and Product Development to achieve business objectives.
• Provide technical guidance and training to technicians and manufacturing personnel on process operation, troubleshooting, and best practices.
• Support quality, and compliance audits to ensure process and documentation adherence to internal and external requirements.

Individuals who will do well in the role usually possess:

• Bachelor's or Master's Degree in Chemical Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or related disciplines.
• Minimum 2-5 years of hands-on semiconductor wafer fab experience in dry etch process engineering.
• Strong knowledge of plasma etching fundamentals, particularly silicon etch, oxide etch, and profile control. Experience with process development, process characterization, DOE, SPC, and statistical data analysis.
• Experience supporting high-volume manufacturing with demonstrated success in yield improvement and defect reduction projects.
• Familiarity with semiconductor process integration and interactions between dry etch and upstream/downstream process modules.
• Experience with process troubleshooting using engineering methodologies such as 8D, DMAIC, or root cause analysis techniques.
• Knowledge of process control systems, FDC, APC, SPC, and process monitoring methodologies is advantageous.
• Strong analytical and problem-solving skills with the ability to handle complex technical challenges independently.
• Good communication, presentation, and technical documentation skills. Self-motivated, proactive, and able to work effectively in a fast-paced manufacturing environment.
• Good team player with strong collaboration skills across global and cross-functional teams.

HP is a Human Capital Partner - we commit to human capital development and adopting progressive workplace practices in Singapore.

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Equal Opportunity Employer (EEO)-

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