Hardware Design Engineer

Responsibilities:

• Design SoC boards from the datasheet and hardware design guide: PMIC and power sequencing, DDR (LPDDR4/DDR3L), eMMC/SPI flash, clocks, boot straps, and debug access.
• Design SoM carrier boards: power input and protection, high-speed connector breakout, CSI/DSI, USB and PCIe.
• Integrate image sensors on your own board or flex: sensor rails and sequencing, MCLK, I2C, reset/trigger lines and MIPI lanes.
• Design hardware trigger and timestamp circuits between multiple cameras and other sensors.
• Lay out compact 4- to 8-layer rigid and rigid-flex boards: define the stackup with the fab, control impedance, length-match diff pairs and plan return paths.
• Bring up new boards: check rails and power-up order, get the memory working, get the first image from each sensor, and debug with the firmware team.
• Release manufacturing files (Gerbers, drill, pick-and-place, BOM, assembly drawings) and handle fab and assembly vendors yourself.

Requirements:

• At least one SoC board with external DDR that you designed, routed and brought up.
• A board built only around a module, or a microcontroller board, doesn't qualify.
• At least one image sensor bring-up over MIPI CSI-2. Plugging in a ready-made camera module or USB camera doesn't count.
• Your own DDR and MIPI routing. You should be able to explain: Your topology choice. Your impedance targets.
• Your length-matching budget. How you handled reference plane changes.
• Fluent in KiCad or Altium, and able to read SoC reference schematics and design guides without help.

Skills

CSI-2, DDR, DDR3L, Lpddr4, MIPI, SOC