Senior Process Engineer Wafer Bonding & Assembly
First seen by Alion on Nov 12, 2026.
Senior Process Engineer Wafer Bonding & Assembly What you will do
You take ownership of temporary wafer bonding and debonding processes and tools, leading process qualification, continuous improvement, problem prevention and the introduction of new processes. Your scope includes: Temporary wafer bonding and debonding Wafer level packaging: (WLUF lamination, molding, CUF dispense, TCB D2W bonding) You lead cross-functional improvements and structured problem-solving across research, engineering and operations, working with technical experts and equipment and material suppliers to resolve complex process and equipment issues. You lead discussions between R&D and Engineering teams to ensure that experiments involving new materials and substrates follow agreed guidelines, including risk assessment. You own process control and documentation for your tools, including recipe management, statistical process control (SPC), procedures, technical escalations, upgrades and recovery flows. You coach process engineers, share technical knowledge and strengthen the engineering capability of the Wafer Bonding & Assembly team. You will work in day-shift.
What we do for you
We offer you the opportunity to join one of the world’s premier research centers in nanotechnology. At imec, you’ll be part of a team shaping tomorrow’s technology. We provide: An open, multicultural, and informal working environment Opportunities to take initiative and show responsibility Support and guidance for your professional growth, including access to imec.academy A competitive salary with many fringe benefits
Who you are
You hold a Master’s degree in Science or Engineering, or have equivalent expertise gained through relevant experience. You bring strong engineering judgement and an analytical approach, with demonstrated experience in process qualification, measurement, data interpretation and quality assurance. You have at least 5 years of relevant experience in temporary wafer bonding and debonding and/or wafer level packaging including ownership of processes or tools and resolution of complex technical issues. You work autonomously, prioritise technical challenges and deliver well-documented, lasting improvements with close attention to quality and detail. You have demonstrated the ability to lead cross-disciplinary technical activities, align stakeholders and coach less experienced engineers. You communicate fluently in English; additional languages are an asset. You communicate technical findings, risks and recommendations clearly, and actively share knowledge to support colleagues and strengthen team expertise. IMEC and its affiliates will not accept unsolicited resumes from any source other than directly from a candidate. IMEC will consider unsolicited referrals and/or resumes submitted by vendors such as search firms, staffing agencies, professional recruiters, fee-based referral services and recruiting agencies (hereafter “Agency”) to have been referred by the Agency free of charge. IMEC will not pay a fee to any Agency that does not have a prior written agreement with IMEC, validated by its HR department, in place regarding a specific job opening and allowing to submit resumes