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Salary
≈ $39k – $83k per year (Estimated)
Location
In office (Taichung)
Seniority
Middle · 3+ years exp

Confirmed on the employer's own hiring board on Sep 25, 2026. First seen by Alion on Aug 28, 2026.

Overview
Company
Impact
Profile match
Winbond Electronics manufactures specialty memory semiconductors. Its portfolio covers code storage flash, dynamic memory and secure devices. The company operates its own wafer fabrication plants.

工作內容

作為華邦的(中科)OPC製像技術發展工程師,你將於產品製程研發階段,接觸公司最先進的製程技術,工作內容包含:

1.負責先進製程光學鄰近效應修正(OPC)、版圖優化與驗證工作。

2.執行 Wafer 量測資料收集、分析與 OPC Model 建立,提升製程視窗與圖形精度。

3.開發、優化及維護 OPC Recipe,執行光罩 Tapeout 流程並確保量產品質。

4.分析光罩與晶圓製程變異來源,提出良率改善與製程最佳化方案。

5.維護及優化 OPC 自動化系統與 Linux Server 環境,提升作業效率與系統穩定性。

6.導入AI、Machine Learning,開發智慧化工程解決方案,提升生產力與工程效率。

7.跨部門團隊合作,推動智慧製造與數位轉型相關專案。

工作地點 中科(台中市大雅區中部科學園區科雅一路8號)

條件要求

學歷要求:碩士

科系要求:工程學科類(全部) │ 自然科學學科類(全部) │

相關經驗:2年以上

語言能力:中文 優級 │ 英文 高級 │

管理責任:No

輪班需求:No

出差需求:1個月以下

外派需求:No

其他條件:

1. 3 years+ experience in Lithography applications on resolution enhancement techniques (RET) and optical proximity correction (OPC).

2. Must have a strong desire to learn and explore new technologies and demonstrate problem-solving skills.

3. Have experience in automation script with one or more programming languages in Linux environment (DRC/Python/TCL, etc).

4. Experience with LLM knowledge base, AI agent, and pytorch/tensorflow project development is preferred.

5. Experience with Linux server administration, job scheduling systems, database management, and web service architectures is preferred.

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