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Location
In office (Hsinchu)
Seniority
Middle · 3+ years exp

Confirmed on the employer's own hiring board on Sep 25, 2026. First seen by Alion on Sep 14, 2026.

Overview
Company
Impact
Profile match
Winbond Electronics manufactures specialty memory semiconductors. Its portfolio covers code storage flash, dynamic memory and secure devices. The company operates its own wafer fabrication plants.

作為華邦的(竹北 / 台中)SAP Software Developer ,你將協助內部需求部門建置完善的資訊系統平台,促進企業內部運作並提升生產力。工作內容包含: ,以下為工作內容、工作條件以及重要通知。

工作內容

1. SAP系統架構及技術規劃:參與系統架構的設計和評估,提供技術方案以確保產品或系統的穩定性、可擴展性及滿足業務需求。確保開發過程中的技術選型和最佳實踐得以執行。

2. 系統開發與管理:負責SAP系統開發、需求分析設計:參與軟體需求分析、設計、開發到測試,確保按照預定的時程和質量完成工作。並對所負責的模塊或項目進行人力和進度管理。

3. 與產品經理合作:與產品經理緊密合作,確保技術方面與產品策略、設計和需求能夠完美對接。對產品的功能性和非功能性需求提供技術評估和建議。

4. 系統維運與故障排解:負責系統的日常維護和監控,出現問題時迅速進行故障排除,並提供技術支援以確保系統的正常運行。

5. 性能優化與安全保護:定期針對系統進行性能檢測和優化,並確保系統的安全性,降低風險。

6. 用戶滿意度提升:確保系統能滿足業務需求,並基於用戶的反饋進行產品的迭代和優化,提升用戶體驗。

工作地點:竹北辦公室(新竹縣竹北市文興路二段539號)

聘僱性質:全職

條件要求

學歷要求:大學

科系要求:資訊管理相關 │ 資訊工程相關 │ 數學及電算機科學學科類(全部)

相關經驗:3年以上

語言能力:英文 中級 │ │

管理責任:No

輪班需求:No

出差需求:無

外派需求:No

其他條件:

1. 具備SAP ABAP / Webdynpro設計開發經驗

2. 具備SAP任一模組SD/MM/SUBCON/FICO開發經驗

3. 具備SAP S4相關經驗佳

4. 具備需求訪談、系統分析能力,可獨立進行系統開發與維護

5. SQL Script, Databases(MSSQL)

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