(竹北/台中) SAP 開發工程師_會計財務模組

Winbond Electronics • Chinese: C1 • Semiconductors • Storage • ABAP • 13 days ago
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Location
In office (Hsinchu)
Seniority
Middle · 3+ years exp

Confirmed on the employer's own hiring board on Sep 25, 2026. First seen by Alion on Sep 11, 2026.

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Profile match

Winbond Electronics

Winbond Electronics manufactures specialty memory semiconductors. Its portfolio covers code storage flash, dynamic memory and secure devices. The company operates its own wafer fabrication plants.
winbond.com • HQ: Taichung, Taiwan • Storage • Semiconductors • 1001-5000 employees • Est. 1987

作為華邦的(竹北/台中) SAP 開發工程師_會計財務模組 ，你將協助內部需求部門建置完善的資訊系統平台，促進企業內部運作並提升生產力。工作內容包含：

工作內容

1. 負責 SAP FI 會計與財務相關作業之系統規劃、設計、開發與優化

2. 與財會及管理單位合作，進行財務流程需求分析、系統設計與改善

3. 進行 SAP ABAP 程式開發，支援財務報表、檢核邏輯、流程自動化與資料整合

4. 支援與 CO、MM、SD 等模組之整合，確保財務資料一致性與正確性

5. 推動財務作業數位化，提升資料準確性、自動化程度與使用者操作體驗

6. 支援系統日常維運、問題排除與後續功能優化

工作地點：竹北辦公室(新竹縣竹北市文興路二段539號)

聘僱性質：全職

條件要求

學歷要求：碩士

科系要求：資訊管理相關 │ 資訊工程相關 │

相關經驗：3年以上

語言能力：英文 中級 │ │

管理責任：No

輪班需求：No

出差需求：無

外派需求：No

其他條件：

1. 3 年以上 SAP 專案經驗，熟悉 FI 會計／財務作業流程者優先

2. 具 SAP ABAP 開發能力，熟悉 Report、ALV、Enhancement、Interface 等程式設計

3. 了解系統需求分析、功能設計與測試流程

4. 具 API / Web Services 整合經驗者加分

5. 具良好跨部門溝通能力、邏輯思考與問題分析解決能力

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