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Salary
≈ $18k – $44k per year (Estimated)
Location
In office (Malacca)
Seniority
Principal · 7+ years exp

Confirmed on the employer's own hiring board on Oct 30, 2026. First seen by Alion on Aug 21, 2026. Infineon Technologies scores B on the Alion truth index.

Overview
Company
Impact
Profile match
Infineon Technologies is a semiconductor company near Munich that was spun out of Siemens in 1999. It is the world leader in power semiconductors and a major supplier of automotive chips, security controllers and sensors. The company operates fabrication plants in Germany, Austria and Malaysia and is building a large new site in Dresden.

Join Infineon as a Lead Principal Engineer Package Technology and drive innovation in advanced semiconductor packaging solutions. In this strategic technical leadership role, you will define and develop future package technologies, lead innovation initiatives, influence technology roadmaps, and collaborate with global stakeholders to deliver cutting-edge packaging solutions from concept to industrialization.

Your role

Key responsibilities in your new role

  • Drive the innovation, definition, and development of advanced package technologies and solutions for new products, from concept feasibility through industrialization.

  • Proactively identify industry trends and emerging technologies in package innovation, supporting feasibility assessments and strategic technology planning.
  • Facilitate and promote innovation within the organization by coaching teams, challenging conventional approaches, and balancing technical risks with business opportunities.
  • Contribute to technology roadmaps, standards development, and long-term business strategies aligned with industry requirements and market trends.
  • Support intellectual property (IP) strategy development by identifying innovation opportunities, generating patents, and enhancing technical reputation through publications and technical presentations.
  • Make key technical decisions within the business and functional areas while taking ownership of implementation and execution activities.
  • Lead package innovation projects and development activities across global cross-functional teams to ensure successful technology deployment.
  • Benchmark competitor and subcontractor package technologies to maintain and strengthen Infineon's technology leadership position.
  • Investigate and evaluate new technologies, materials, and packaging concepts while actively managing associated technical risks.
  • Serve as the technical authority for package technology innovation and provide expert guidance to stakeholders, project teams, and engineering organizations.
  • Mentor and develop engineers by sharing technical knowledge, best practices, and innovation methodologies.
  • Drive measurable business impact through technology leadership, innovation implementation, and successful execution of strategic initiatives.

Your profile

Qualifications and skills to help you succeed

  • A Bachelor's Degree in Engineering, preferably in Semiconductor Technology, Microelectronics, Automation, Mechanical Engineering, Electrical Engineering, Electronics, Physics, or a related discipline.

  • Minimum 7 years of relevant experience in the semiconductor, IC packaging, SMT, assembly, or test manufacturing environment.
  • Strong knowledge of Semiconductor Packaging, Surface Mount Technology (SMT), Assembly, and Test processes.
  • Solid understanding of Process Engineering and Equipment Engineering within semiconductor manufacturing.
  • Experience in Failure Analysis, Reliability Engineering, and root cause investigation methodologies.
  • Strong analytical thinking, technical problem-solving, and decision-making capabilities.
  • Experience leading technology innovation initiatives, technical projects, and cross-functional engineering teams.
  • Proven ability to develop technology roadmaps, conduct feasibility studies, and drive technology implementation.
  • Knowledge of intellectual property development, patent generation, and technology benchmarking is an added advantage.
  • Proficiency in AutoCAD and 3D drafting tools is preferred.
  • Excellent communication and stakeholder management skills, with the ability to influence technical and business decisions across organizational levels.
  • Strong mentoring and coaching abilities with a passion for developing engineering talent.
  • A proactive, innovative, and results-oriented mindset with a strong sense of ownership and accountability.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

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