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Location
In office (Samut Prakan)
Seniority
Staff · 7+ years exp
Visa
Sponsors visas in United States, Ireland, United Kingdom; no register of this country names it

Confirmed on the employer's own hiring board on Nov 10, 2026. First seen by Alion on Nov 3, 2026. Infineon Technologies scores B on the Alion truth index.

Overview
Company
Impact
Profile match
Infineon Technologies is a semiconductor company near Munich that was spun out of Siemens in 1999. It is the world leader in power semiconductors and a major supplier of automotive chips, security controllers and sensors. The company operates fabrication plants in Germany, Austria and Malaysia and is building a large new site in Dresden.

Define and develop semiconductor packages from concept to realization, driving package design, technology, cost and innovation for new products

Your role

Key responsibilities in your new role

  • Drive technical definition for package projects with major changes or new packages, including BOM, package design, assembly technology, PRP review and project classification.
  • Generate conceptual package outlines and internal construction drawings, finalize and document drawings, and update package drawings as needed.
  • Define package characteristics to meet electrical, thermal, reliability and mechanical requirements.
  • Coordinate Package Cost Estimation and Cost Indication.
  • Act as the contact partner for package definition, particularly on Back-End assembly technology know-how.
  • Support pre-development and project definition and continue as the package design expert throughout the project phase.
  • Actively scout for new packaging technologies and keep up with package development at competitors and subcontractors.
  • Serve as the main contact for questions and discussions regarding packaging, package design and package roadmap.
  • Drive innovation and pre-development activities within the package platform.

Your profile

Qualifications and skills to help you succeed

  • Minimum Bachelor’s Degree in Engineering, such as Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics or Physics.
  • At least 7 years of relevant working experience in an IC/semiconductor environment.
  • Strong knowledge of Semiconductor Packaging, Assembly and Test.
  • Knowledge of Process and Equipment Engineering.
  • Knowledge of Failure Analysis and Reliability Engineering.
  • Strong analytical and problem-solving skills.
  • AutoCAD and 3D drafting knowledge is preferred

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

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