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Location
In office (Samut Prakan)
Seniority
Staff · 7+ years exp
Visa
Sponsors visas in United States, Ireland, United Kingdom; no register of this country names it

Confirmed on the employer's own hiring board on Nov 10, 2026. First seen by Alion on Nov 3, 2026. Infineon Technologies scores B on the Alion truth index.

Overview
Company
Impact
Profile match
Infineon Technologies is a semiconductor company near Munich that was spun out of Siemens in 1999. It is the world leader in power semiconductors and a major supplier of automotive chips, security controllers and sensors. The company operates fabrication plants in Germany, Austria and Malaysia and is building a large new site in Dresden.

Drive technology integration for semiconductor packaging, focusing on process interaction, risk assessment and new chip technology integration.

Your role

Key responsibilities in your new role

  • Drive Technology Integration activities to ensure the package fulfills requirements in terms of process interaction.
  • Perform PBC and TPC assessments and drive Package Technology DFMEA.
  • Own Risk Interaction assessment and mitigation work packages.
  • Drive pre-development for new chip technology.
  • Integrate unit processes (BOM and Process) and new chip technology into the package platform, including risk assessment, process interaction studies, and process flow.
  • Provide technical guidance and assistance to projects as needed.
  • Drive 8D/problem solving for interaction issues.
  • Work closely with FE on FE/BE interaction and integration topics.
  • Assess the impact of design rules on inter-process interaction.

Your profile

Qualifications and skills to help you succeed

  • Minimum Bachelor’s Degree in Engineering, such as Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics or Physics.
  • At least 7 years of relevant working experience in an IC/semiconductor environment.
  • Strong knowledge of FE/BE interaction and BE/BE interaction.
  • Experience with 8D & T6s methodology.
  • Knowledge of DFMEA/PFMEA.
  • Knowledge of internal package analysis and first-level reliability.
  • Strong assembly process knowledge and understanding of surface properties.
  • Experience with DOE & Comparative method.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

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