Sr. Staff Engineer Package Process Development SON

Your Role

Key responsibilities in your new role

1.PBC and TPC assessment (Process flow & unit process definition and potential risk assessment together with UPD/PJM and experts)

2.Driver of Package Technology DFMEA Process of Record

3.Owner of Risk Interaction assessment and mitigation work packages

4.Integration of unit processes (BOM and Process) in package platform-Risk assessment, study interaction with other processes, process flow

5.Working partner for FE in FE/BE interaction and integration topics

6.Ensure process stability, quality of the manufacturing route for the mass-production release

7.Actively contribute to the project team while reporting on development progress and risk mitigation actions to ensure project objectives are met

8.Support and be in a technical leading role for product portfolio extension

Your Profile

Qualifications and skills to help you succeed

1.Bachelor or Master’s Degree in Mechanical, Electrical or Electronics Engineering, Material Science, Metallurgical Engineering or a related discipline

2.At least 10 years of working experience in semiconductor packaging

3.Prior experience in DSC, Map mold, SON, TO, DSO power product development is strongly preferred

4.Knowledge of DFMEA/PFMEA, FE/BE and BE/BE Interaction, Internal Package analysis/ first level reliability

5.Advanced skills in statistical data analysis (8D, T6s, DOE)

6.Good aptitude for communication, collaboration, negotiation and solution finding

7.A structured and analytical mindset with a proven ability to drive complex topics independently from analysis to implementation

8.Competent in daily oral & written English for cross-functional and overseas communication

9.Project management experience is a benefit

Contact:

[email protected], LinkedIn

#WeAreIn for driving decarbonization and digitalization.

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