Staff Engineer Unit Process Development Wire Bond

Join our team as a Staff Engineer in Unit Process Development Wire Bond, where you will drive semiconductor process innovation, enhance manufacturing capabilities, and lead process development initiatives. Be part of a dynamic engineering environment focused on delivering high-quality, cost-effective, and reliable manufacturing solutions.

Your role

Key responsibilities in your new role

• Lead process development activities, including process parameter scouting, optimization, verification, and process freeze, to ensure project targets are achieved in terms of timeline, quality, cost competitiveness, and manufacturability.
• Drive technical handshakes and knowledge transfers to Operations, while supporting prototype and development sample builds.
• Prepare, maintain, and update technical documentation, including Process Specifications, PFMEA, DFMEA, OJTI, T32, and PDR.
• Ensure the accuracy and completeness of process-related documents, such as Process of Record, Assembly Design Rules, Process Roadmaps, Failure Catalogues, Control Plans, and Maintenance Checklists.
• Collaborate with suppliers to drive continuous improvement and conduct verification and qualification activities for new tooling, machines, and materials.
• Participate in task forces, focus teams, and complex problem-solving initiatives using statistical and analytical tools such as SPC, APC, DOE, 8D, FMEA, and DFMEA.
• Identify, develop, and implement new process technologies while improving process capabilities to meet evolving business requirements.
• Contribute technical expertise to the selection and definition of process technologies, materials, machines, and tooling.
• Provide technical guidance and mentoring to new engineers and project team members.
• Initiate and develop intellectual property (IP) ideas through technical research, reading, and innovation.
• Contribute technical expertise and professional judgement to support decision-making within the area of specialization.

Your profile

Qualifications and skills to help you succeed

• Master's or Bachelor's Degree in Engineering or a related discipline.
• Minimum of 5 years of relevant working experience in the semiconductor manufacturing industry, preferably in Wire Bond processes.
• Strong hands-on knowledge and practical experience in semiconductor assembly processes.
• Good understanding of material science and chemical engineering principles.
• Strong knowledge of analytical equipment and their applications.
• Excellent analytical thinking, problem-solving, and technical decision-making skills.
• Experience in statistical data analysis, particularly Design of Experiments (DOE).
• Ability to collaborate effectively with cross-functional teams, suppliers, and internal stakeholders.
• Strong communication, technical documentation, and knowledge-sharing skills.
• Proactive mindset with the ability to identify process improvement opportunities and develop innovative solutions.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

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We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

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