Module Engineer

Job Details:

Job Description:

The Role and Impact

We are looking for a talented and driven professional to join our team as a Technical Contributor. In this role, you will play a key part in advancing technical solutions and processes that directly impact Intel's ability to deliver innovative products and services to customers worldwide. You will focus on developing, implementing, and optimizing technologies related to Die Prep or Die Sort module technology, enabling critical advancements in precision manufacturing and quality assurance.

Business Group

You will be part of Intel Corporation, a leading technology company committed to shaping the future of computing and connectivity. Within the Die Prep or Die Sort module group, you will contribute to groundbreaking work that supports the design, development, and manufacturing processes at Intel. This team focuses on driving innovation in Die Prep and Die Sort technology, ensuring Intel's leadership in cutting-edge solutions.

Key Responsibilities

• Own process control, equipment performance, and manufacturing readiness for the assigned Die Prep or Die Sort module.
• Drive improvements in safety, quality, yield, productivity, utilization, and cost through engineering solutions.
• Lead troubleshooting and root-cause analysis of process, equipment, and quality issues, implementing sustainable corrective actions.
• Develop, optimize, and maintain process recipes, control limits, specifications, and equipment operating conditions.
• Support equipment installation, qualification, NPI transfers, and high-volume manufacturing (HVM) ramp activities.
• Collaborate with cross-functional teams to improve manufacturing capability, capacity, automation, and operational excellence while standardizing best-known methods (BKM).

  Qualifications:

  Minimum Qualifications
• Bachelor's or Master's degree in Engineering, Physics, Materials Science, or related discipline.
• Strong analytical thinking and structured problem-solving skills.
• Basic knowledge of DOE, SPC, and statistical analysis.
• Experience working with manufacturing data and process control systems.
• Strong communication and collaboration skills in a fast-paced environment.

Preferred Qualifications

• Semiconductor or advanced manufacturing experience.
• Experience in process/equipment qualification, NPI, and production ramp.
• Knowledge of SPC, FMEA, DOE, and root-cause analysis methodologies.
• Experience with automation, programming, SQL, or manufacturing data analytics.

• Familiarity with Die Prep/Die Sort processes, equipment, inspection, or automation systems.

Job Type:

Intel Contract Employee

Shift:

Shift 1 (China)

Primary Location:

PRC, Chengdu

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.