Process Integration & Program Leader, Hybrid Bonding / 3DIC

Job Details:

Job Description:

About the Role

Lead the integration and execution of next-generation hybrid bonding and 3DIC technologies, taking complex semiconductor technology from development through qualification, manufacturing ramp, and high-volume production.

This is a highly visible technical leadership role responsible for bringing together process development, yield, manufacturing, quality, product engineering, and business teams. You will solve complex integration challenges, drive critical technology decisions, manage execution risk, and ensure successful delivery against performance, yield, reliability, schedule, and customer commitments.

Responsibilities

• Own the process integration strategy and execution for advanced hybrid bonding and 3DIC technologies.
• Drive cross-module optimization across performance, yield, defectivity, reliability, quality, cost, and manufacturability.
• Lead resolution of complex process integration and manufacturing challenges.
• Drive technology maturity from development through qualification, technology transfer, manufacturing ramp, and HVM.
• Lead integrated execution across Process Development, Module Engineering, Yield, Manufacturing, Quality, Product Engineering, Supply Chain, and business organizations.
• Establish technical priorities, evaluate tradeoffs, manage risks, and drive cross-functional decisions.
• Partner with customers and product teams to translate requirements into technology and execution priorities.
• Communicate technology readiness, risks, and recommendations to senior leadership and customer stakeholders.
• Drive technical learning and best-known methods across development and manufacturing organizations.

Required Skills and Experience

• Significant semiconductor technology-development experience spanning process integration and manufacturing.
• Experience leading complex technologies from development through qualification and manufacturing ramp.
• Strong expertise in process integration, yield improvement, defect reduction, quality, reliability, and manufacturing problem solving.
• Demonstrated ability to lead large, cross-functional technical programs and drive decisions across organizational boundaries.
• Experience engaging directly with customers on technical requirements, risks, commitments, and escalations.

Preferred Skills and Experience

• Experience with hybrid bonding, 3DIC, heterogeneous integration, wafer-level packaging, advanced interconnect, or leading-edge semiconductor process technologies.
• Experience taking advanced semiconductor technologies into high-volume manufacturing.
• Strong technical judgment and a track record of solving difficult integration, yield, and manufacturing problems.
• Ability to influence senior technical leaders, customers, and cross-functional stakeholders in a fast-moving development environment.

Qualifications:

• Degree in Engineering, Materials Science, Physics, or related technical field
• BS with 12+ years of relevant experience; MS with 8+ years; or PhD with 6+ years.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $248,400.00-350,690.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.