Location
In office (Wuxi)
Confirmed on the employer's own hiring board on Oct 18, 2026. First seen by Alion on Mar 12, 2024. Maxscend Microelectronics scores C on the Alion truth index.
Overview
Company
Impact
Profile match
Maxscend Microelectronics designs radio frequency front-end chips for mobile devices. Its switches, low noise amplifiers and filters ship in large smartphone volumes. The company also produces radio frequency modules and sensors.
岗位职责 / Responsibilities
1. 负责新客户以及新包装要求的导入。
2. 负责现有包装资料的维护,新包装供应商/新包装材料的导入,新文件的编写。
3. 负责现有包装制程,流程的优化以及推动代工厂完成包装的优化,cost down等。
4. 负责包装以及测试制程的问题点分析与改善。
5. 负责标签自动化,包装自动化,包装防呆的导入和优化。
6. 负责工厂包装,测试制程异常的处理。
7. 负责新载带设计和导入。
8. 负责内外部沟通,日常工作报告汇总,参加必要的会议;
9. 完成上级分配的其他相关工作。
任职要求 / Requirements
1. 本科及以上学历,工作经验丰富的话可以放宽要求。
2. 包装,测试PE相关的工作两年以上的工作经验
3. 熟悉半导体芯片测试包装常规流程以及基本规范,并对包装防呆,制程防呆等有一定的了解
4. 熟练使用Notes、Outlook、Office等办公软件;
5. 熟悉常规的半导体包装材料(载带,覆盖带,纸盒,卷盘,铝箔袋等)的特性,设计规格等
6. 熟悉载带相关的设计规格和要求。
7. 有较强的推动能力,有责任心,重视团队合作,喜欢挑战性和高强度工作;
8. 有新包装方式,新包装方式导入经验的优先考虑
9. 有国内外知名测试厂工作经验者会优先考虑。
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