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Salary
≈ $37k – $99k per year (Estimated)
Location
In office (Hsinchu)

Confirmed on the employer's own hiring board on Sep 24, 2026. First seen by Alion on Sep 22, 2026.

Overview
Company
Impact
Profile match
MediaTek Inc. is a global fabless semiconductor company specializing in system-on-chip (SoC) architectures and digital multimedia processing technologies. The enterprise designs and markets integrated circuits for smartphones, smart home devices, IoT hardware, wireless connectivity solutions, automotive electronics, and custom AI chips for edge and cloud applications. Headquartered in Hsinchu, Taiwan, the organization operates an international network of research, development, and sales offices serving original equipment manufacturers (OEMs) and technology brands worldwide.
Join our next-generation HPC SoC team to build cutting-edge Chiplet interconnect solutions. Whether you are an experienced architect or a recent graduate with strong fundamentals, this role offers a clear path to becoming a specialist in UCIe, D2D, and Advanced Packaging technologies. We value potential and provide the mentorship needed to grow into the role.

1. Develop Die-to-die and UCIe digital IP for HPC SOC.

Design and implement robust digital IP blocks that enable high-bandwidth, low-latency communication across chiplets in complex HPC systems.

2. Integration of D2D controller and PHY to timing closure and DFT.

Drive the integration flow between controllers and PHY layers, ensuring timing closure sign-off and implementing design-for-test strategies for manufacturing quality.

3. Define interface specifications, creating comprehensive verification plans, and support integration and physical implementation.

Own the interface definition lifecycle, develop rigorous verification plans, and collaborate on physical implementation.

4. Work closely with multiple teams such as mixed mode designers and Firmware engineers.

Partner across disciplines to align on system-level goals, debug complex integration issues, and ensure seamless firmware-hardware co-design.

#LI-LYNN

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