Dry Etch MTS/Principal Engineer, Process Development SG, Advanced NAND

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

As a Principal Engineer/MTS (Member of Technical Staff), you will join a groundbreaking Next Generation NAND research and development Dry Etch team working on critical modules listed below. This role offers many opportunities for innovation, collaboration, and expanding capabilities with Next Generation NAND. You will collaborate closely with process integration and other areas such as Wet Etch, CVD, Diffusion, Metals, Lithography, and CMP. You will manage powerful dry etch chambers and lead the process roadmap to achieve program and yield targets. Your responsibilities include, but are not limited to:

Leading innovation in Dry Etch technology and essential module advancement

• Develop and innovate dry etch processes to meet structural and electrical specifications.
• Work together with hardware teams to develop the equipment roadmap for the current and upcoming generation of NAND products.
• Show expertise in dry etch technology fundamentals and possess a mechanistic understanding of how process parameters affect outcomes.
• Collaborate and lead cross-functional teams to solve complex structural problems.
• Present process and technology roadmaps for current and future technology nodes.
• Proactively predict when and how a future issue could arise and build mitigation plans.
• Contribute towards the Technical Leadership Program.
• Mentor less experienced engineers and encourage skills within the team.
• Be associated with critical modules such as HAR, Tier by tier etches, WL contacts & staircase.

Collaboration with other Process Areas

• Find opportunities and drive towards a collaborative solution.
• Guide other areas on technology roadmaps.
• Lead or be part of cross-functional task force groups driving towards a target.
• Drive towards general expertise in other areas' process hardware or technologies.

Interaction with Dry Etch peers

• Serve as a resource and mentor for colleagues in dry etch technology and/or project management.
• Provide critical updates to upper management on project status and impacts.

Successful candidates for this position will have:

• Demonstrated interest in research and development environment.
• 6-10 years’ experience in dry etch process development in R&D moving into manufacturing.
• 4-5 years of applicable NAND, DRAM, or Logic module development experience, for example: projects and deliveries involving cross-functional teams.
• Knowledge of plasma physics, plasma chemistry, transport or surface phenomena gained through experience and/or coursework.
• Demonstrated leadership in problem-solving. Experience in managing technical projects.
• Understanding various types of plasma dry etch reactors (e.g., RF sources, chemistries).
• Expertise in statistical process control and analysis.
• Experience in solving scalability problems of deep high aspect ratio silicon/dielectric etches with a fundamental understanding of advanced conventional and unconventional (tailored) pulsing schemes.
• Lead supplier head-to-heads.
• Data science basics/Python coding/AI coders shall be preferred over candidates without this experience.
• Strong computer skills, including MS Office, and SAS software like JmP oe similar.

Education

• Masters/PhD or equivalent experience in Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor engineering, or related fields, along with at least 6 years of pertinent dry etch process development experience.
• Bachelors/Masters (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor engineering or related fields) with at least 10 years of pertinent dry etch process development experience.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations,please contact [email protected]

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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