Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)
Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Our vision is to transform how the world uses information to enrich life forall.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As the member of HIG HBM Package Product Engineering, you will be part of a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization.
Key Responsibilities
ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process.
HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization and coverages by collaboration with Technology Development and Packaging organizations to reduce Manufacturing Line Yield.
Cumulative Yield Ownership: Work with cross-functional teams, to lead impactful initiatives that significantly enhance overall cumulative yield and quality improvement, driving substantial benefits for the organization.
Root Cause and Resolution of Qual and RMA Packaging Issues: Debug and identify root cause and failures in by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.
Backend Process Conversions and HVM: Work with FAB, Technology Development, Advanced Packaging TD, Package Development Teams to establish a robust Process Conversion Business Process to facilitate Yield Improvement, DPM Improvement and overall performance of HBM Products. Provide recommendation to PDE teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies.
Cross-Functional Collaboration: Work closely with various cross-functional teams, including Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams, to ensure the holistic development and successful shipping of end products.
Promotion of Innovation: Promote innovation and drive changes that provide a technical advantage over competitors, maintaining the company's competitive edge in the market.
Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.
AI/ML Advocate: Collaborate with cross-functional teams to develop, deploy, and validate AI/ML models aimed at enhancing key performance indicators (KPIs) such as Quality, Cost, Cycle Time, and Scale.
Requirements
Bachelors/Masters of Electrical/Electronic/Mechanical Engineering Degree with more than 3 years of experience in the semiconductor industry. Product Engineering and Packaging Experience is preferred.
Demonstrating Competent Technical Skills, especially in problem solving with root cause understanding and solution space through in depth circuit analysis.
Good knowledge of statistics and data analysis tools and scripting.
Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).
Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.
Strong sense of responsibility and accountability towards assigned role with professional work ethic.
Excellent communication and presentation skills.
Passionate about people leadership, with a drive toward ongoing learning and development in this area.
Work on site in Singapore with international travel to Taiwan, US, Japan.
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
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