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Salary
$60k – $150k per year
Location
In office (Redmond)
Seniority
Junior · 2+ years exp
Employment
Full-Time
Overview
Company
Impact
Profile match
Microsoft is an American multinational technology corporation founded in 1975 by Bill Gates and Paul Allen and headquartered in Redmond, Washington. It built the personal computing era around the Windows operating system and the Office productivity suite, and now generates the largest share of its revenue from Azure cloud infrastructure and commercial subscriptions. The company also owns GitHub, LinkedIn and the Xbox gaming business, and has invested heavily in artificial intelligence through its partnership with OpenAI and the Copilot assistants embedded across its products.

Job Description

Job Title: Packaging Engineer. Location: Redmond, Washington, USA

Responsibilities:

  • Execute end-to-end quantum device package assembly and builds.
  • Operate manufacturing equipment, provide training, and optimize processes.
  • Maintain packaging configuration documentation and records;
  • Analyze and solve assembly process failures.
  • Perform reliability testing, adhesive characterization, and process development.
  • Develop and maintain robust assembly processes for quantum devices.
  • Support general laboratory organization and upkeep.
  • Work independently or as part of a team as required.

Qualifications:

  • Bachelor's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or a related field, or equivalent experience.
  • Ability to meet Microsoft, customer, and government security screening requirements.
  • Must pass the Microsoft Cloud Background Check upon hire or transfer and every two years thereafter;
  • Must meet applicable export control requirements and provide citizenship or eligible residency documentation where required.
  • Ability to use AI tools for performance modeling, analysis, research, and task automation.
  • Ability to evaluate agentic AI solutions using measurable metrics and human-in-the-loop safeguards under Microsoft Responsible AI requirements.

Preferred:

  • Master's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or a related field, or a bachelor's degree plus 2+ years of technical engineering experience.
  • Hands-on experience with industry-standard packaging and assembly processes, including wire bonding, die bonding, and adhesive dispensing.
  • Hands-on experience with packaging materials including PCBs, adhesives, and solder;
  • Ability to work effectively in teams, communicate clearly, meet deadlines, and deliver results.
  • 2+ years of hands-on experience packaging complex optomechanical, MEMS, or microwave devices.

Benefits and Compensation:

  • Typical U.S. base salary: $85,400 to $168,100 per year.
  • San Francisco Bay Area and New York City metropolitan area range: $111,100 to $183,700 per year;
  • Certain roles may be eligible for additional benefits and compensation.
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