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Mechanical Packaging Engineer Co-op

Nokia • Mobile Networks • Network Equipment • Master's Degree • 2 days ago

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Salary

≈ $79k – $187k per year (Estimated)

Location

In office (Sunnyvale)

Confirmed on the employer's own hiring board on Oct 18, 2026. First seen by Alion on Oct 16, 2026. Nokia scores A on the Alion truth index.

Overview

Company

Impact

Profile match

Nokia

Nokia is a Finnish telecommunications equipment company founded in 1865 as a paper mill, which became the world's largest mobile phone maker in the 1990s before selling that business to Microsoft in 2014. It now supplies network infrastructure to operators and enterprises, covering radio access equipment for mobile networks, optical and IP routing for transport networks, fixed broadband access, and a technologies division that licenses its cellular patent portfolio. Headquartered in Espoo and listed in Helsinki and New York, it runs Nokia Bell Labs as its research arm and has been expanding into data centre networking as operator spending has slowed.

nokia.com • HQ: Espoo, Finland • Optical Communications • Mobile Networks • Network Equipment • 5000+ employees • Est. 1865

Tech stack of Nokia

Backed by Oak Investment Partners, Mercury Fund

Number of Positions: 1

Date: Jan 2027 - Apr 2027

Duration: 4 months

Location: Onsite in Sunnyvale, CA or New York, NY

EDUCATIONAL RECOMMENDATIONS

Current M.S. or Ph.D. student in mechanical engineering, physics, or other similar fields or related field with an accredited school in US.

Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
Support advanced packaging components and test fixtures for new products using 3D software and generate manufacturing drawings.
Apply in-depth knowledge of Design for Manufacturing principles and stay current with new technological advancements.
Drive package debug activities during product validation and qualification.

Experience with 3D CAD design, tolerance analysis, and GD&T with SolidWorks or similar software.
Experience with thermal and thermo-mechanical simulations using ANSYS or similar software.
Experience with documentation of fabrication, inspection, and assembly processes.
Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.

It would be nice if you also had:

Knowledge of design for manufacturing of 2.5D/3D packaging.
Experience in high-speed electronics package design and/or laser package design.
Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience.
Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.

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