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In office (Yokneam)
Seniority
Senior · 5+ years exp
Visa
Sponsors visas in United States, United Kingdom; no register of this country names it
Employment
Full-Time

Confirmed on the employer's own hiring board on Nov 10, 2026. First seen by Alion on Nov 8, 2026. NVIDIA scores B on the Alion truth index.

Overview
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Impact
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NVIDIA is an American technology company founded in 1993 that invented the graphics processing unit and has become the dominant supplier of accelerated computing platforms for artificial intelligence. Its portfolio spans data centre GPUs and systems built on the Hopper and Blackwell architectures, GeForce consumer graphics, automotive and robotics platforms, high-speed networking acquired with Mellanox, and the CUDA software stack that binds the ecosystem together. Headquartered in Santa Clara, California, the company sells to cloud providers, enterprises, research institutions and gamers worldwide and is one of the most valuable listed businesses on the Nasdaq.

NVIDIA is looking for a HW Mechanical Engineer to join the IC Product Engineering HW team. You will lead the mechanical design and execution of test hardware for NVIDIA’s networking and CPO (Co-Packaged Optics) products: test boards, sockets, handler interfaces, system-level test (SLT) mechanical interfaces, and HTOL platforms.

NVIDIA’s Networking division is a leading supplier of end-to-end InfiniBand and Ethernet connectivity solutions for data centers, including adapter cards, switches, cables and software. Our products deliver industry-leading bandwidth, performance and scalability. The IC PE HW team ensures these products are tested and qualified for high-volume production.

What you’ll be doing:

  • Design, define and qualify test sockets, contactors, handler change kits and thermal solutions for high-power, high-speed devices, with full ownership of the mechanical specification, mechanical component selection, and mechanical constraints for board layout (keep-out zones, placement, stiffening). Manage the external vendors who supply them, including drawing reviews and design sign-off.
  • Lead lab bring-up and debug, and define the thermal and mechanical constraints of test platforms so they deploy efficiently and robustly on the production floor, while meeting high-speed signal integrity requirements.
  • Work with the most advanced ATE platforms in the industry, including Teradyne UltraFLEX / UltraFLEXplus and Advantest V93K testers and probers.
  • Develop mechanical interfaces for optical systems on production ATE equipment, and define new design concepts for future CPO products.
  • Collaborate with R&D and Production teams: board design, system-level test, signal integrity, layout, firmware and test engineering.
  • Lead HTOL (High-Temperature Operating Life) hardware platforms for reliability testing.

What we need to see:

  • B.Sc. in Mechanical Engineering.
  • 5+ years of experience as a Mechanical Design Engineer, with hands-on 3D CAD (Creo preferred)
  • Proven ownership of projects end-to-end, with the ability to work independently and drive multiple projects and vendors in parallel.
  • Understanding of digital circuits, power delivery and high-speed design constraints as they affect mechanical design.
  • Strong personal skills: self-learner, multi-disciplinary, able to multitask, with excellent interpersonal skills.

Ways to stand out:

  • working alongside a board design team.
  • System-level understanding and familiarity with production environments (SLT and final test).
  • Hands-on experience with test sockets (pogo pin, coax), ATE handlers, and thermal control (tri-temp).
  • Experience with high-power, large-body BGA packages, and with thermal analysis or simulation.
  • Experience with optical or fiber interfaces in a test setup.
  • Experience managing external mechanical vendors and tooling suppliers, including reviewing and approving manufacturing drawings.
  • Strong GD&T and tolerance stack-up skills.
  • Experience with HTOL, burn-in or other reliability test hardware.
  • Ability to mentor junior engineers.
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