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Location
In office (Fukushima)
Visa
No sponsorship (stated in the posting)

Confirmed on the employer's own hiring board on Nov 3, 2026. First seen by Alion on Jul 10, 2026. onsemi scores B on the Alion truth index.

Overview
Company
Impact
Profile match
Onsemi is an American semiconductor company that was spun out of Motorola in 1999 and has since narrowed itself from a broad commodity chip supplier into a focused power and sensing business. Its silicon carbide and silicon power devices go into electric vehicle traction inverters, chargers and industrial drives, while its image sensors are used in automotive cameras and industrial vision, and it has deliberately exited lower-margin product lines to concentrate on these markets. Headquartered in Scottsdale, Arizona and listed on Nasdaq, it owns its own silicon carbide substrate manufacturing to secure supply.

Manufacturing Engineering (Equipment/Process) Manager

Location: Aizuwakamatsu, Fukushima, Japan

Background of the Position

Due to strong demand for power devices, particularly driven by AI-related applications, there is an urgent need to further improve factory productivity. In particular, there are challenges in stabilizing and improving equipment performance. We are seeking a professional who can lead on-site equipment/process engineering, with broad knowledge and experience in semiconductor manufacturing equipment and processes, as well as strong industry connections.

Roles and Responsibilities

- Serve as the Equipment/Process Engineering Manager for Front-End Semiconductor Processes (8-inch), specifically Diffusion and Implantation (Ion Implantation).

- Production Engineering / Process Development: Establish mass production technology, optimize processes, and launch new technologies and new equipment.

- Yield / Quality Improvement: Investigate root causes of issues, develop countermeasures, and improve yield and quality.

- Team Management: Set goals, manage resources, and develop team members.

- Cost and Equipment Management: Improve uptime, lead productivity initiatives, and manage CAPEX.

- Communicate and negotiate with global teams and suppliers in English.

Requirement

- Hands-on experience in equipment engineering or process engineering for semiconductor diffusion and/or ion implantation processes (approximately 10+ years)

- Management experience in a semiconductor wafer fabrication facility (e.g., Team Leader, Section Manager, Project Manager, or equivalent)

- Proven experience leading projects and coordinating with cross-functional teams, including Manufacturing, Engineering, and Quality organizations

- Experience managing business relationships, negotiations, and collaboration with industry partners and external companies

- Strong English communication and negotiation skills for working with global teams at the U.S. headquarters and with suppliers

- Business-level English proficiency (TOEIC score of 600 or above preferred)

- Japanese language proficiency (equivalent to JLPT N2 level or above)

- Valid work authorization that permits employment in Japan at the time of application

- No visa sponsorship available for this position

Preferred Qualifications

- Knowledge beyond diffusion/implantation processes

- Experience with fab ramp-up or next-generation processes

- Experience in multinational companies

- Experience in driving process optimization and business improvement using AI technologies

Ideal Candidate Profile

- Logical problem-solving based on data

- Ability to balance site-level and overall optimization

- Leadership across functions

- Adaptability to fast-changing industry

- Strong focus on team development

Location and Compensation

Location: Aizuwakamatsu, Fukushima, Japan

Salary: Flexible based on experience and skills

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