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Salary
$112k – $225k per year (Estimated)
Location
In office (Allen)
Seniority
Staff · 10+ years exp
Overview
Company
Impact
Profile match
Onsemi is an American semiconductor company that was spun out of Motorola in 1999 and has since narrowed itself from a broad commodity chip supplier into a focused power and sensing business. Its silicon carbide and silicon power devices go into electric vehicle traction inverters, chargers and industrial drives, while its image sensors are used in automotive cameras and industrial vision, and it has deliberately exited lower-margin product lines to concentrate on these markets. Headquartered in Scottsdale, Arizona and listed on Nasdaq, it owns its own silicon carbide substrate manufacturing to secure supply.

Job Summary:

The Staff Test Quality Engineer is a senior, hands-on technical role within the Corporate Quality organization responsible for strengthening semiconductor test strategy, test coverage, and manufacturing quality controls across wafer sort, final test, and production release flows. This role partners closely with business groups, product engineering, test engineering, manufacturing, design, and external manufacturing sites to reduce test escapes, improve outgoing quality, and institutionalize best-in-class test standards. The ideal candidate brings more than 10 years of semiconductor test engineering experience with deep hands-on expertise in analog and digital testing, test methodologies, debug, test hardware and software development, statistical data analysis, and the establishment of DFT and DFM standards for high-reliability products.

  • Establish and maintain corporate standards for Design for Test (DFT), Design for Manufacturing (DFM), test coverage, guardbanding, and mandatory production test requirements for new product introductions and sustaining production programs.
  • Ensure smooth transitions into mass production, and continuous support for high yield and quality of the manufactured products.
  • Review and audit analog, digital, mixed-signal, wafer sort, and final test programs to verify datasheet compliance, test coverage effectiveness, limit integrity, and identification of critical test gaps.
  • Provide hands-on technical leadership for test-related customer issues, 8D investigations, failure containment, root cause analysis, and corrective action plans involving test coverage, hardware, software, or methodology gaps.
  • Systematically apply lessons learned on existing products and new product development to continuously improve quality.
  • Lead cross-functional problem solving across product, test, design, quality, and manufacturing teams to identify systemic test weaknesses, develop scalable solutions, and drive adoption across multiple sites and product families.
  • Evaluate product-specific test strategies, including analog and digital test methodologies, hardware configurations, software flows, fault coverage, multisite efficiency, and production robustness.
  • Ensure controls are implemented on commercial and automotive projects to meet AEC-Q100 and ISO standards. Review 'escapes' from lot disposition process and work to close any systematic gaps and share learning for continuous improvement.
  • Improve outgoing defect levels by analyzing customer returns, low-yield lots, marginal distributions, and recurring failure modes to develop improved screens, maverick controls, and test coverage enhancements.
  • Evaluate live pilot testing of test monitoring & escape prevention software.
  • Analyze large datasets to detect and control test stability issues and improve first pass yields on high count parallel test solutions; identify and contain systems and hardware with abnormal test results.
  • Define architecture, workflows, documentation requirements, and governance models for standardized test solution deployment, test program updates, hardware release controls, and production change management.
  • Establish and maintain corporate documentation of policies and procedures to ensure consistent practices across company and external manufacturing facilities.

Requirements:

  • Bachelor’s degree in Electrical Engineering, Computer Engineering, Semiconductor Engineering, or related technical discipline; advanced degree preferred.
  • More than 10 years of hands-on semiconductor test engineering experience supporting wafer sort, final test, production release, sustaining product engineering, or manufacturing quality.
  • Strong knowledge of Automotive APQP, xFMEAs and Safe Launch methodologies to develop high-quality products to meet customer expectations.
  • Hands-on experience with 8D problem solving, FTAs and Risk Analysis/Assessments.
  • Proven track record of driving and achieving results on committed timelines.
  • Strong hands-on proficiency in analog and digital test development, test programming, test methodology definition, vector pattern generation and analysis, probe and final test data analysis, debug, characterization, and production correlation. Familiarity with platforms such as Exensio is a plus.
  • Experience with ATE platforms such as Eagle, Teradyne/Flex, LTX, Advantest, Verigy, or equivalent production test systems is highly desired.
  • Ability to adapt to new tools and technologies quickly.
  • Strong team player with excellent communication and presentation skills.
  • Exceptional analytical and interpersonal skills, with a problem-solving mindset
  • Solid foundation in semiconductor device physics, manufacturing processes, test failure mechanisms, reliability concerns, and product engineering for analog ICs, digital ICs, discrete devices, and multi-chip modules.
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