Thermal Engineer, Staff

Company:

Job Area:

General Summary:

Qualcomm’s Hardware Systems organization is seeking a seasoned Thermal Engineer to join our Taiwan team. The qualified individual will be creating innovative solutions resolving complex thermal management challenges supporting data center AI applications, and will apply analytical and empirical skills on the development of advanced thermal architecture solutions for high performance packages utilized in data center applications.

Responsibilities

• Perform package and system-level thermal modeling to maximize thermal performance of various packages.

• Design, set up, run, and deliver results for various thermal experiments to validate performance of hardware.

• Manage technical projects and collaborate with other internal organizations and OEMs/ODMs to support the execution process throughout development cycle.

• Perform thermal simulations and tests and prepare and present results to stakeholders from various disciplines.

Skills and Experience

• 8+ years of industry experience in electronics cooling preferably related to data center packages and systems.

• Expertise in conducting CFD simulations utilizing tools such as ANSYS-Icepak, Flotherm, or Celsius-EC.

• Skillset and hands-on experience to enable test hardware/platforms and execute test vectors for the purpose of thermal validation and verification testing.

• Ability to write scripts and data analysis. Programming experience with Python, C/C++.

• Debugging and bring up experience, in addition to operating data acquisition equipment required.

• Ability to design thermal tests and execute per plan within a laboratory environment.

• Must have experience with selection of thermal management materials.

• In-depth understanding of forced convection and liquid cooling. Exposure to cooling systems related to data center industry is a plus.

• Must have thermal design experience with PCBs, enclosures, and heat sinks.

• Some experience with 3D geometry CAD tools such as Solidworks or Creo.

• Excellent presentation, negotiation, and communication skills.

Education Requirements

• MSME or PhD in Mechanical Engineering

Keywords

AI, data center,3DIC packages, heat transfer, CFD, ANSYS-Icepak, Flotherm, Celsius-EC, thermal management, thermal test, fans, natural convection, forced convection, radiation, conduction, liquid cooling.

Minimum Qualifications:

OR

Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.

OR

PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.

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