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Salary
≈ $15k – $43k per year (Estimated)
Location
In office (Seremban)
Seniority
Senior · 5+ years exp

Confirmed on the employer's own hiring board on Oct 12, 2026. First seen by Alion on Sep 30, 2026.

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苏科思科技(Sioux Technologies) 是您可信赖的综合研发服务供应商 ,可支持高科技企业 / 机构的研发项目或作为其研发部门,助其研发和组装小批量、多学科集成、高度复杂、搭载先进软件组件的系统和产品。.

We are hiring a Senior Software Engineer in Seremban to build and maintain the software that connects semiconductor back-end equipment to the factory host. The role centres on SECS/GEM equipment control, legacy integration (SOAP), and handling wafer maps and test data across assembly and test lines.

About the role

You will own the software layer between back-end production equipment and the factory systems (MES, host, test data servers). Your work keeps machines connected, recipes and lots flowing correctly, and wafer maps and test results accurate from die attach through final test.

The focus is back-end assembly and test, not wafer-fab (front-end) processing. It is also a backend and integration role: no web front-end or UI design work is expected, although you will maintain lightweight web pages and tools used by engineers.

The existing codebase includes applications written in Ada. We do not expect Ada experience; strong C++ engineers who are willing to learn and maintain Ada code are a good fit.

Key Responsibilities:

Equipment integration and control

  • Design, develop and maintain SECS/GEM interfaces (SEMI E4/SECS-I, E5/SECS-II, E30/GEM, E37/HSMS) between back-end equipment and host/MES systems.

  • Integrate new and existing die bonders, wire bonders, moulding systems, testers, handlers and AOI tools, including collection events, alarms, variables, remote commands and recipe management.

  • Support equipment qualification, factory acceptance and site acceptance testing for automation software.

Legacy systems and interfaces

  • Maintain and extend legacy integrations built on SOAP web services, XML and proprietary protocols.

  • Maintain, debug and modernise existing Ada and C++ applications while keeping production lines running.

  • Build connectors and adapters between legacy services and newer platforms, including message-bus based integration (e.g. JMS).

Wafer maps and test data

  • Develop and support software that handles wafer maps (e.g. SEMI E142, SINF/TSK and vendor formats) for die picking and bin tracking.

  • Handle test data flows (e.g. STDF, bin summaries, lot/yield data) from testers to data servers and yield systems.

  • Ensure data integrity and traceability across lots, wafers, strips and units.

Support, quality and collaboration

  • Provide second- and third-line support for production issues, including root-cause analysis and permanent fixes.

  • Maintain Windows-based equipment PCs and servers: services, configuration, scheduled tasks, logs and patches in cooperation with IT.

  • Build and maintain simple internal web tools (HTML, JavaScript, CSS) for engineering use.

  • Write technical documentation, follow change-control procedures and participate in code reviews.

  • Work with equipment, process, test and IT engineers, and with equipment vendors, to resolve interface issues.

  • Mentor junior engineers and share knowledge within the team.

Requirements

  • Master’s or Bachelor's Degree in Computer Science, Software Engineering, Electrical/Electronic Engineering, Mechatronics or a related field.

  • At least 5 years of software development experience, including 3+ years in semiconductor or electronics manufacturing automation.

  • Hands-on experience in a back-end assembly and test environment; experience at a semiconductor manufacturer (e.g. Infineon, STMicroelectronics, onsemi, Intel) or an OSAT or equipment supplier is an advantage.

  • Working knowledge of SECS/GEM (SECS-II messages, GEM state models, HSMS) and practical experience connecting equipment to a host or MES.

  • Proficiency in C++ (or Ada); readiness to maintain Ada code if coming from C++.

  • Experience with SOAP web services, WSDL and XML, and other legacy communication protocols.

  • Understanding of back-end processes and equipment: die bonding, wire bonding, moulding, test and AOI.

  • Knowledge of wafer maps and semiconductor test data (formats, binning, lot and wafer genealogy).

  • Basic web development skills in HTML, JavaScript and CSS.

  • Good knowledge of Windows as an operating system: services, networking, file shares, registry, event logs and troubleshooting.

  • Solid debugging skills, including reading SECS logs and network traces.

  • Good command of English, written and spoken; Bahasa Malaysia is an advantage.

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