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Location
In office (Kuala Lumpur)
Seniority
Junior · 2+ years exp

Confirmed on the employer's own hiring board on Oct 12, 2026. First seen by Alion on Sep 28, 2026.

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Headquartered in Dallas, Texas, Texas Instruments is a global semiconductor design and manufacturing company that develops analog chips and embedded processors. The firm serves tens of thousands of customers worldwide, helping them create advanced electronics for industrial, automotive, personal electronics, and enterprise markets. Through continuous innovation in semiconductor technology, the corporation plays a pivotal role in shaping modern electronic systems and power management solutions.

Change the world. Love your job.

Texas Instruments is seeking a Process Engineer to lead the digital design of our Die Prep manufacturing processes. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1-2 years. Once the system is live, you will return to a production role, using your knowledge of digital process controls to drive yield and efficiency.

Key Responsibilities:

  • MES Implementation (Project Phase): Drive Die Prep process design within the MES. Define flows, routing, and material handling.
  • Control & Exception Handling: Define digital process controls and exception handling (holds/rework) specific to Die Prep/Dicing operations.
  • Alignment & Validation: Validate workflows with quality and manufacturing teams; support UAT and deployment.
  • Sustaining (Post-Project Phase): Return to production to utilize MES data for process optimization, yield analysis, and managing Die Prep process stability.

Minimum requirements:

  • Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
  • Strong hands-on semiconductor process experience in Die Prep, with minimum 2 years of relevant experience
  • Strong foundation in statistical process control, engineering change control and process release strategies

Preferred qualifications:

  • Experience working with MES platforms, whether Siemens OpCenter or another comparable MES product modeling or configuration
  • Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and escalate early.
  • Equip with backgrind, dicing process, mechanical saw & laser saw process experiences are welcome
  • Demonstrated strong analytical and problem solving skills
  • Strong verbal and written communication skills
  • Ability to work in teams and collaborate effectively with people in different functions
  • Strong time management skills that enable on-time project delivery
  • Demonstrated ability to build strong, influential relationships
  • Ability to work effectively in a fast-paced and rapidly changing environment
  • Ability to take the initiative and drive for result
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