2027研發替代役-嵌入式韌體開發

工作內容

主要工作職責

1. Develop firmware for embedded systems, including Android/Linux BSP development, porting, and testing.

2. Debug and optimize system-level interactions between MPU and MCU, including integration of third-party APIs and low-level libraries.

3. Create and execute unit tests to ensure firmware robustness, addressing edge cases, system stability, and overall reliability.

主要工作內容

1. Develop and integrate Android HAL, kernel drivers, and low-level services for SoC-based systems.

2. Design and implement MCU firmware for hardware control, power management, and peripheral communication.

3. Analyze and resolve firmware bugs to ensure system stability and performance on AR or wearable devices.

4. Collaborate with system architects, software leads, and hardware teams to define requirements and review technical specifications.

5. Explore and evaluate new technologies applicable to next-generation embedded products.

Key Attractions

We develop advanced smart glasses platforms and manufacture the devices locally in Taiwan. This is a rare opportunity to take part in multiple innovative projects and products, while gaining end-to-end visibility into the entire product lifecycle - from early-stage development to full-scale mass production. Youll be working in an international, flexible, and sustainability-driven environment that fosters creativity, collaboration, and continuous growth. If youre looking for a role that balances work-life harmony with challenging, high-impact development, this is the opportunity for you.

條件要求

1. 碩士資訊工程相關科系畢業

2. TOEIC 500+

Programming Language

1. Preferred: Java, C/C++

2. Nice to have: Kotlin

3. Basic: Python, Shell Script

4. Plus: Objective-C, Swift

Knowledge

1.Speech recognition and voice-activated processing

2.Embedded Computer Vision Sensors

3.Deep Learning for Image processing

薪資

面議(將依學經歷進行敘薪)