Development Engineer – Adhesive Bonding Process Technology (f/m/x)

ZEISS Semiconductor Manufacturing Technology

Enabler for smaller, more powerful, and more energy-efficient microchips

Working for tomorrow today.

Around 80 percent of all microchips worldwide are produced using ZEISS technologies. As the centerpiece of every electronically controlled system, they have become an integral part of our everyday lives - whether in smartphones, smart homes or smart factories. ZEISS is a technology leader in the field of semiconductor manufacturing equipment. With high-precision lithography optics, photomask systems and process control solutions, ZEISS enables the production of ever smaller, increasingly powerful, and more energy-efficient microchips, and thus plays a pivotal role in the age of micro- and nanoelectronics.

Your Role

• Develop adhesive bonding processes and associated equipment for optomechanical assemblies and systems that form key elements of our latest optics for the semiconductor industry. This includes applying state-of-the-art adhesive applications and dispensing technologies to achieve highly precise and reliable bonded joints.

• Develop, validate, and qualify application processes and the required fixtures, then transfer them into production, including technical documentation and process capability analysis.

• Coordinate cross-functional collaboration with relevant specialist departments throughout the design, manufacturing, assembly, and commissioning of adhesive bonding fixtures, while ensuring achievement of performance, cost, and schedule targets.

• Align technical requirements with customers and suppliers during the development phase.

• Perform tolerance analysis and tolerance budgeting for processes, tooling, and manufacturing methods.

Your Profile

• A successfully completed university degree in mechanical engineering, mechatronics, manufacturing engineering, plastics engineering, or a comparable discipline.

• Ideally, knowledge of adhesive bonding processes, adhesive application technologies, adhesive dispensing, and/or adhesive material properties.

• Experience in the conceptual design and dimensioning of assembly stations and tooling, preferably for adhesive application processes.

• Knowledge of assembly and alignment processes for optomechanical components and related tolerance budgeting is an advantage.

• Strong teamwork and communication skills, combined with enthusiasm for close collaboration with production teams and cross-functional interfaces.

• A proactive, committed, and independent working style, together with an interest in working in a cleanroom environment.

• Good written and spoken German and English language skills.

Your ZEISS Recruiting Team: