Overview
News
Salaries
Products
People
Growth
Offices
Financials

Funding and backers

Total raised
$140M
1 round on record
Latest round
$140M
Series B · Mar 2026 · 6 mo ago
Backers
1
Qiming Venture Partners
The money's age
Fresh money
6 months since the last round · not hiring
Momentum
35/100
in the news, fresh money
Last sign of life
this month
a posting or a news item
The story so fareach stage dated by its source: the company's releases, the press, registers, filings
Sep 17 Partnership CiXTech Partners with Canonical to Lower Barriers for Edge AI Devices · autonews.gasgoo.com Mar 30 Raised a round Series B $140M 2021 Founded
Funding rounds
RoundDateAmountInvestorsSource
Series B Mar 2026 $140M — 投资界
Backed byfrom the funds' portfolios and accelerator catalogs

Overview

此芯科技是一家专注于设计开发端侧智能CPU芯片及高能效算力解决方案的科技型企业。此芯科技成立于2021年,公司汇聚了国内外芯片设计、软件生态及终端应用领域的资深人才,以创新为驱动,致力于研发高性能、低功耗的通用CPU,赋能个人计算、智能座舱和具身智能等前沿领域。此芯科技致力于为社会提供领先的端侧智能算力解决方案,并与全球顶尖客户及生态伙伴紧密合作,共同构建开放、统一的算力基础,推动智能计算技术的持续进化与落地。.

Offices

Where the company hires and what each office is for
Cities
1
Hiring now
0
Countries
1
Shanghai China
HQ

Financials

Total raised
$140M
Latest round
Series B
Funding rounds
1
Funding rounds
Round Announced Amount
Series B 2026 $140M Details