Signal Integrity & Power Integrity Engineer

Job Details:

Job Description:

Job Description:

We are seeking a highly experienced Signal Integrity & Power Integrity (SI/PI) Engineer with 8+ years of industry experience to lead the design, verification, and optimization of high-speed interconnects across silicon, IC package, and board-level architectures.

In this role, you will deliver end-to-end SI/PI solutions for large and complex high-speed platforms, including advanced IC packages, validation boards, and development kits. You will define and optimize the electrical design space for high-speed SERDES, die-to-die interconnects, memory interfaces, and FPGA fabric, leveraging advanced 2D and 3D electricalmodelingand extraction techniques. Responsibilities include defining robust simulation methodologies, conducting design-of-experiments(DOE) during early exploration phases, establishing SI/PI design rules to guide physical implementation, reviewing layouts, performing post-layout simulations, and continuously improving electrical design margins.

You will apply deep expertise in high-speed electrical modelingand simulation to influence package and platform design decisions, with a strong focus on debugging and resolving complex interconnect challenges.

This position requires close collaboration with SI/PI specialists, silicon architects, package engineers, and board design teams throughout product pathfinding and development cycles. By leveraging advanced simulation, modeling, and emerging AI-driven methodologies, you will drive the optimization of FPGA electrical performance across IC packages and hardware platforms, ensuring industry-leading signal quality, robust power delivery, and cost-effective design trade-offs.

Key Responsibilities

• Leadend-to-end signal and power integrity design for IC packages, validation platforms, and development kit hardware to achieve best-in-class electrical performance and reliability.

• Define and deploybest-in-class SI/PI simulation methodologies, leveraging advanced EDA tools and AI-assisted techniques to improve accuracy, efficiency, and product quality.

• Perform detailed simulation, review, and trade-off analysis ofpackage and board designs to ensure scalable and robust electrical solutions.

• Diagnose and resolve complexsystem-level SI/PI challenges spanning electrical, mechanical, thermal, and manufacturing constraints.

• Collaborate acrosssilicon, package, and board design teams to define optimized electrical solutions that meet performance targets while minimizing product cost and maximizing customer competitiveness.

• Driveforward-looking SI/PI technologies, including advanced and heterogeneous packaging solutions, to support and influence future product architectures.

Qualifications:

Qualifications:

• Master’s or PhD in Electrical Engineering, Computer Engineering, or a related field, with a strong foundation in electromagnetics, circuit analysis, and signal processing.

• 10+ years of hands-on experience in Signal Integrity and Power Integrity engineering across silicon, package, and board-level designs.

• Deep expertise in high-speed digital interfaces, SI/PI fundamentals, and power delivery network behavior.

• Proficiency with industry-standard simulation and modeling tools such as ANSYS HFSS, Synopsys HSPICE, Cadence Sigrity, Keysight ADS, or equivalent platforms.

• Strong analytical skills to interpret, correlate, and validate simulation, design, and measurement data.

• Proven ability to solve complex, multi-domain SI/PI problems with a structured and methodical approach.

• Hands-on experience withsilicon/package/boardlayout and design tools (e.g., Mentor Graphics, Cadence Allegro).

• Scripting and automation experience using Python, MATLAB, or similar languages is highly desirable.

Job Type:

Shift:

Primary Location:

Additional Locations:

Posting Statement: