Technical Program Manager, Thermal & Mechanical Engineering
Confirmed on the employer's own hiring board on Oct 24, 2026. First seen by Alion on Oct 16, 2026. AMD scores B on the Alion truth index.
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THE ROLE:
You will lead thermal, mechanical and advanced board-assembly development programs from requirements through engineering builds, qualification, manufacturing release and production ramp. You will connect package, board, cooling and chassis integration to make sure engineering and supplier deliverables support the product schedule. The role includes regional travel to supplier sites and engineering builds.
THE PERSON:
You are an individual contributor who drives decisions across global engineering, manufacturing and supplier teams without direct authority. You have enough technical depth to challenge assumptions and assess risk, while engineering owners keep design approval. You communicate clearly with engineers and executives alike.
KEY RESPONSIBILITIES:
- Define program scope, milestones, owners and acceptance criteria. Build integrated schedules and manage critical paths, resources and budgets.
- Coordinate package, board and chassis interfaces, including thermal, power, mechanical and assembly requirements, and assess the impact of design changes.
- Lead execution reviews with cooling suppliers, CMs, ODMs and OSATs. Track specifications, samples, tooling, capacity, quality and recovery actions.
- Plan engineering and validation builds, and drive evidence-based entry and exit decisions at each milestone.
- Coordinate program deliverables for advanced SMT and large BGA assembly, including process windows, warpage mitigation, defect reduction, edge bond/underfill and BGA rework, with the responsible engineers.
- Manage risks, issues, dependencies and engineering changes. Present recovery options with schedule, cost and qualification impact to decision-makers.
- Drive DFM/DFA reviews, release documentation, manufacturing handover, ramp issue closure and lessons learned.
PREFERRED EXPERIENCE:
- Substantial experience in thermal/mechanical hardware, electronic packaging or electronics NPI, including leading complex cross-functional technical programs.
- Proven delivery from engineering development through qualification and production ramp.
- Working knowledge of SMT processes and large BGA assembly challenges (warpage, coplanarity, solder-joint integrity) is advantageous.
- Understanding of the package-to-system heat path, TIMs, tolerance stack-ups, shock/vibration and board-level reliability qualification is advantageous.
- Experience managing cooling suppliers, CMs, ODMs or OSATs, preferably in the Asia-Pacific region is advantageous.
- Experience with DOE, root-cause analysis (8D, FMEA) and phase-gate program management is advantageous.
- Proficient in English, technical writing and executive communication skills.
- High-performance computing, GPU or server programs; liquid/air cooling products; PMP or equivalent; Power BI, SQL or Python is advantageous.
ACADEMIC CREDENTIALS:
- Bachelor's degree in Mechanical, Materials, Manufacturing, Electrical or Electronics Engineering, or a related discipline. Equivalent directly relevant experience may be considered.
LOCATION:
Penang, Malaysia
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
THE ROLE:
You will lead thermal, mechanical and advanced board-assembly development programs from requirements through engineering builds, qualification, manufacturing release and production ramp. You will connect package, board, cooling and chassis integration to make sure engineering and supplier deliverables support the product schedule. The role includes regional travel to supplier sites and engineering builds.
THE PERSON:
You are an individual contributor who drives decisions across global engineering, manufacturing and supplier teams without direct authority. You have enough technical depth to challenge assumptions and assess risk, while engineering owners keep design approval. You communicate clearly with engineers and executives alike.
KEY RESPONSIBILITIES:
- Define program scope, milestones, owners and acceptance criteria. Build integrated schedules and manage critical paths, resources and budgets.
- Coordinate package, board and chassis interfaces, including thermal, power, mechanical and assembly requirements, and assess the impact of design changes.
- Lead execution reviews with cooling suppliers, CMs, ODMs and OSATs. Track specifications, samples, tooling, capacity, quality and recovery actions.
- Plan engineering and validation builds, and drive evidence-based entry and exit decisions at each milestone.
- Coordinate program deliverables for advanced SMT and large BGA assembly, including process windows, warpage mitigation, defect reduction, edge bond/underfill and BGA rework, with the responsible engineers.
- Manage risks, issues, dependencies and engineering changes. Present recovery options with schedule, cost and qualification impact to decision-makers.
- Drive DFM/DFA reviews, release documentation, manufacturing handover, ramp issue closure and lessons learned.
PREFERRED EXPERIENCE:
- Substantial experience in thermal/mechanical hardware, electronic packaging or electronics NPI, including leading complex cross-functional technical programs.
- Proven delivery from engineering development through qualification and production ramp.
- Working knowledge of SMT processes and large BGA assembly challenges (warpage, coplanarity, solder-joint integrity) is advantageous.
- Understanding of the package-to-system heat path, TIMs, tolerance stack-ups, shock/vibration and board-level reliability qualification is advantageous.
- Experience managing cooling suppliers, CMs, ODMs or OSATs, preferably in the Asia-Pacific region is advantageous.
- Experience with DOE, root-cause analysis (8D, FMEA) and phase-gate program management is advantageous.
- Proficient in English, technical writing and executive communication skills.
- High-performance computing, GPU or server programs; liquid/air cooling products; PMP or equivalent; Power BI, SQL or Python is advantageous.
ACADEMIC CREDENTIALS:
- Bachelor's degree in Mechanical, Materials, Manufacturing, Electrical or Electronics Engineering, or a related discipline. Equivalent directly relevant experience may be considered.
LOCATION:
Penang, Malaysia
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.