Lead Engineer - PCB Design

What you’ll do:

The Lead PCB Design Engineer is responsible for leading the design, development, and optimization of printed circuit board (PCB) solutions for electronic products. This role ensures high-quality, manufacturable, and reliable PCB designs, drives design standardization and process improvements, provides technical leadership, and collaborates with cross-functional teams to deliver innovative and cost-effective products

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• Lead end-to-end PCB development from concept, schematic review, layout, validation, and production release.

• Able to lead Program with multiple PCBs and deliver with help of one or more resources
• Design complex multi-layer PCBs for:

-Data center power distribution and management systems

-Thermal management and cooling control systems

-Know-how of OCP Rack and its structure

-Hands-on experience in High Voltage, High Current PCBs

Develop PCB solutions considering:

-Signal Integrity (SI)

-Power Integrity (PI)

-EMC/EMI compliance

-Thermal performance

-Reliability and Manufacturability

• Define stack-ups, controlled impedance requirements, high-current power routing, grounding strategies, and power distribution networks.
• Collaborate with electrical, mechanical, thermal, firmware, manufacturing, and test teams to optimize overall product performance.
• Support design reviews, prototype builds, debugging, root-cause analysis, qualification testing, and certification activities.
• Drive PCB design standardization, library management, design automation, and continuous improvement initiatives.
• Mentor PCB designers and provide technical leadership across global engineering teams."

Qualifications:

Required: Bachelor’s Degree in Electronics / Electronics and Communication / Electrical Engineering.

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• 12-14 years of PCB design experience in power electronics or thermal management products.

Skills:

• Expert knowledge of multi-layer PCB design using Altium Designer, Cadence Allegro, or equivalent EDA tools.

"Required:

Strong experience in below:

• Experience with High Power, Flex, Rigid Flex & HDI PCBS.
• High-speed interfaces (DDR, PCIe, Ethernet, USB, SerDes)
• Power electronics and power conversion systems
• Creepage clearance and safety requirements
• SI/PI analysis and simulation
• Thermal-aware PCB design
• DFM, DFA, and DFT methodologies

Well versed with Data Center Rack Architectures, including rack-level power distribution, monitoring, control systems, AI/HPC infrastructure, and cooling solutions.

Good understanding of thermal management technologies including air-cooled and liquid-cooled systems used in modern data centers.

Able to do Power Integrity or Signal Integrity Simulations will be added advantage

Standards & Compliance: Strong working knowledge on below:

• IPC Standards: IPC-2221/2222, IPC-7351, IPC-A-600, IPC-A-610, IPC-6012, IPC-2152 etc.
• Safety & Regulatory Standards: UL, CSA, IEC 62368-1, IEC 61010, IEC 60664, CE, EMC/EMI, RoHS, and REACH

Desired:

• Experience supporting product certification, safety reviews, and regulatory compliance activities is preferred. .

Special:

• CAM validation, check and basic editing of Gerber data using CAM350."

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• Strong leadership, communication, and problem-solving skills.

• Ability to work effectively in cross-functional and global engineering environments. "