Senior Mechanical/Thermal Engineer
Confirmed on the employer's own hiring board on Nov 4, 2026. First seen by Alion on Nov 3, 2026. Horizon Robotics scores B on the Alion truth index.
工作职责 / Responsibilities
Job Description:
In this position, you will be a member of the advanced package development team in Horizon. With your technical background in mechanical/thermal engineering, you will be responsible for FCBGA/MCM/FOP mechanical/thermal solution enablement including mechanical/thermal simulation, mechanical/thermal characterization and modeling calibration. You will also work with different team to help setup mechanical/thermal test platform if needed. As a key contributor in the advanced package development team, you will work closely with partner groups and organizations, including OSAT, material vendors and customer interface. You will be responsible for delivering technical training to customers, help customers solve mechanical/thermal challenges.
Responsibilities may include:
1、Proactively addresses Mechanical/Thermal risk/issues.
2、Create new mechanical/thermal innovations that enable higher mechanical/thermal performance, at both package and board level
3、Mechanical/Thermal modeling of package applications that provide high confidence reliability/thermal performance in all user conditions
4、Analyze mechanical/thermal test/validation data and correlate to mechanical/thermal modeling.
5、Conduct mechanical/thermal testing and characterization (advanced).
任职要求 / Requirements
Qualifications:
As a successful candidate, you must exhibit the following behavioral traits: Interpersonal, communication, problem solving and analytical skills. Comfortable working independently in a fast-paced environment.
Minimum Qualifications:
Master's degree/above in Mechanical/thermal Engineering or related and 2+ years of technical experience with IC package thermal solution &mechanical simulation
1、Experience with Heat transfer fundamentals as they apply to electronics cooling.
2、Experience with Thermal/mechanical simulation software (such as Flotherm or Icepak, and Ansys).
3、Hands-on experience of thermal testing techniques.
Preferred qualifications:
1、Experience with overall package mechanical/thermal modeling process.
2、Experience with Instron/T3ster is highly desired