(中科)EAP/EES Software Engineer

Winbond Electronics • Chinese: C1 • Semiconductor Manufacturing • Memory & Storage Chips • JavaScript • TypeScript • SQL • C# • 11 days ago
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Salary
≈ $11k – $26k per year (Estimated)
Location
In office (Taichung)
Seniority
Junior · 1+ year exp

Confirmed on the employer's own hiring board on Oct 23, 2026. First seen by Alion on Oct 12, 2026.

Overview
Company
Impact
Profile match

Winbond Electronics

Winbond Electronics manufactures specialty memory semiconductors. Its portfolio covers code storage flash, dynamic memory and secure devices. The company operates its own wafer fabrication plants.
winbond.com • HQ: Taichung, Taiwan • Semiconductor Manufacturing • Memory & Storage Chips • 1001-5000 employees • Est. 1987
Tech stack of Winbond Electronics

作為華邦的(中科)EAP/EES Software Engineer，你將成為打造世界一流智慧工廠的一份子，負責建置並維護全自動化智慧工廠的生產資訊系統，以兼具創意與效率的IT手法解決工廠問題，進而提昇生產品質與效率。

EAP/EES 工程師必須擁有製程與機台相關的基本知識，結合 SEMI Standard 與 程式開發能力，理解並分析使用者真實需求，進而設計功能、開發系統並上線維運。

[Responsibilities & Tasks]

1. 機台連線程式(EAP)與 EES 系統 (FDC, R2R, RMS ...) 的開發與維護

2. 工廠自動化系統值班與問題排除

3. 協同機台或軟體廠商與公司內部跨部門成員一同合作建置工廠自動化方案

4. 分析使用者需求，規劃設計最佳解決方案，協調分配開發資源，並依循軟體開發規範開發符合使用者需求的系統。

[Requirements]

1. 一年以上 EAP/EES 工作經驗

2. 具備 C# 程式開發、關聯式資料庫 SQL 操作經驗

3. 熟悉 Angular、ASP.Net MVC 尤佳

4. 具備 UML 設計或敏捷式開發經驗尤佳

5. 熟悉 Git 版本管理

6. 善於溝通和協調，抗壓性高

7. 能配合輪班 On Call 處理工廠自動化系統問題

8. 對系統流程優化有興趣並能持續改善

條件要求

學歷要求：碩士

科系要求：資訊工程相關 │ 資訊管理相關 │

相關經驗：1年以上

語言能力：英文 中級

管理責任：No

輪班需求：No

出差需求：無

外派需求：No

其他條件：無

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