Salary
≈ $44k – $100k per year (Estimated)
Location
In office (Hsinchu)
Seniority
Senior · 5+ years exp
Confirmed on the employer's own hiring board on Sep 24, 2026. First seen by Alion on Sep 16, 2026.
Overview
Company
Impact
Profile match
Winbond Electronics manufactures specialty memory semiconductors. Its portfolio covers code storage flash, dynamic memory and secure devices. The company operates its own wafer fabrication plants.
作為華邦的(竹北) Cube記憶體產品行銷工程師,你將進行新產品的驗證,協助客戶進行產品應用並提供售後的技術支援。工作內容包含:,以下為工作內容、工作條件以及重要通知。
工作內容
1. Cube記憶體產品技術行銷
2. Cube記憶體產品規劃
3. Cube產品專案管理
4. Cube產品跨部門溝通與資源協調
5. Cube產品流程優化與專案管理機制改善
工作地點:竹北辦公室(新竹縣竹北市文興路二段539號)
聘僱性質:全職
條件要求
學歷要求:大學
科系要求:電機電子工程相關│ 材料工程相關│ 工程學科類(全部)
相關經驗:5年以上
語言能力:英文高級│ │
管理責任:No
輪班需求:No
出差需求:1個月以下
外派需求:No
其他條件:
1. 需具備PM經驗
2. 有ASIC、SOC或記憶體經驗者佳
3. 有產品工程、IC測試、製程、FAE佳
4. 有先進封裝經驗者佳
5. 需配合經常性國外出差(至少每季1次)
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