(中科)客製化記憶體產品工程師

Winbond Electronics • Chinese: C1 • Semiconductors • Storage • 2 days ago
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Salary
≈ $28k – $77k per year (Estimated)
Location
In office (Taichung)
Seniority
Junior · 2+ years exp

Confirmed on the employer's own hiring board on Sep 25, 2026. First seen by Alion on Sep 22, 2026.

Overview
Company
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Profile match

Winbond Electronics

Winbond Electronics manufactures specialty memory semiconductors. Its portfolio covers code storage flash, dynamic memory and secure devices. The company operates its own wafer fabrication plants.
winbond.com • HQ: Taichung, Taiwan • Storage • Semiconductors • Est. 1987

作為華邦的(中科)客製化記憶體產品工程師 ，你將負責把關產品生產週期的每一道關卡，確保產品良率、性能及品質。工作內容包含： ，以下為工作內容、工作條件。

工作內容

1. 客製化記憶體先進新製程技術開發

2. 新產品導入、良率、品質及可靠度提升至可量產階段

3. 生產及工程問題分析與改善

4. 具故障分析能力

5. 異常產品缺陷分析及工程實驗分析與改善

工作地點

中科(台中市大雅區中部科學園區科雅一路8號)

條件要求

學歷要求：大學

科系要求：工程學科類(全部) │ 自然科學學科類(全部) │

相關經驗：2年以上

語言能力：英文 中級 │ 中文 中級 │

管理責任：No

輪班需求：No

出差需求：1個月以下

外派需求：No

其他條件：

1.擅長工具:Win7/10、Excel、Outlook、PowerPoint、Word、JMP

2.工作技能:半導體材料良率分析, 具備製程開發, 製程整合, 產品失效分析, Defect Team或reliability分析經驗者佳

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