Engineer Reliability (Advanced Packaging Technologies / Surface Mount Technology)

The Engineer

Reliability will be responsible for developing and executing reliability

assessment strategies for new semiconductor package technologies, identifying

and mitigating risks, supporting qualification activities, and collaborating

with cross-functional teams to ensure package reliability meets customer and

industry requirements.

Your role

Key responsibilities in your new role

• Define a reliability assessment plan for new package technologies using a failure mechanism-based approach and determine the technical capability of

  package technologies to meet specified reliability requirements, including the setup of customer mission profiles.

• Identify new failure modes, detect unexpected results and statistical outliers, and assess potential risks that are not

  covered by existing standards.

• Execute reliability stress tests and physical analyses, evaluate

  reliability data, and derive conclusions and recommendations.

• Participate in project discussions related to package delta analyses and risk assessments.
• Support the qualification of new packages, processes, and production changes.
• Evaluate and qualify chip embedding packages and high-density power

  modules for AI-applications.

• Generate and establish work-instructions f or physical

  failure analysis.

• Make sure to follow the current and agreed reliability standards

  (mainly industrial).

Your profile

Qualifications and skills to help you succeed

• Minimum Bachelor's or Master's degree in Materials Science, Physics,

  Electrical Engineering, or Electronics Engineering.

• Minimum 1 year of experience in the frontend or backend semiconductor manufacturing industry. Experience in reliability and

  qualification activities is preferred.

• Ability to work independently, take a proactive approach, and drive

  value through continuous improvement initiatives.

• Strong team player with excellent communication and interpersonal

  skills.

• Familiarity with problem-solving techniques, statistical analysis,

  Failure Mode and Effects Analysis (FMEA), Python programming, and Tableau is an advantage.

• Experience in advanced packaging technologies (e.g., chip embedding) or Surface Mount Technology (SMT) is an added advantage.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

Carol Lee