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Salary
≈ $21k – $47k per year (Estimated)
Location
Hybrid (Taipei, Hsinchu, Taiwan)
Seniority
Senior · 4+ years exp
Employment
Full-Time

Confirmed on the employer's own hiring board on Oct 21, 2026. First seen by Alion on Oct 21, 2026. Intel scores B on the Alion truth index.

Overview
Company
Impact
Profile match
Intel is an American semiconductor company founded in 1968 by Robert Noyce and Gordon Moore and headquartered in Santa Clara, California. It created the x86 instruction set that still underpins most personal computers and servers, and designs and manufactures processors, chipsets, discrete graphics, networking silicon and AI accelerators. Unlike most of its competitors the company owns its fabrication plants, and it is investing heavily in Intel Foundry to manufacture chips for external customers while rebuilding its process technology leadership.

Job Details:

Job Description:

The Role and Impact

As a Process Integration Development Engineer, you will play a pivotal role in driving revolutionary advancements in substrate manufacturing technologies. You will oversee the development, optimization, and integration of cutting-edge processes to improve performance, yield, and reliability of substrates used in semiconductor packaging. Through hands-on collaboration with cross-functional teams, your work will directly contribute to Intel's leadership in innovative packaging solutions and manufacturing excellence.

Business group

Asia Capex Substrate Integration is part of Intel Corporation's broader effort to deliver world-class substrate packaging solutions, enabling the development of advanced semiconductor technologies. The group focuses on integrating high-performance substrate processes, driving innovation in manufacturing and packaging, and supporting Intel's mission of creating technology that powers global progress.

Key Responsibilities

  • Develop and optimize process integration methodologies for advanced substrates, ensuring high yield and product reliability.
  • Collaborate with cross-functional teams including design, manufacturing, and quality groups to identify and address technical challenges.
  • Evaluate and implement new materials, tools, and techniques to improve substrate performance and cost efficiency.
  • Conduct detailed analysis to troubleshoot process issues and drive continuous improvement initiatives.
  • Support technology transfer and ramp-up for high-volume manufacturing operations.
  • Document process development efforts and results, creating clear guidelines for production teams.
  • Expectation is for candidate to be at supplier factory on-site for minimum of 4 days a week

Qualifications:

Minimum Qualifications

  • Bachelor's degree in a relevant field such as Materials Science, Chemical Engineering, Mechanical Engineering, or a closely related discipline.
  • 3+ years of hands-on experience in process integration or substrate development within semiconductor manufacturing.
  • Proficiency in process characterization techniques and tools, including SEM, AFM, X-ray, or similar methodologies.
  • Demonstrated ability to analyze process data and implement data-driven improvements.
  • Strong knowledge of substrate and packaging technologies in semiconductor applications.

Preferred Qualifications

  • Master's or Ph.D. degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related field with 4+ years experience.
  • Proven track record of developing innovative solutions to complex technical challenges.
  • Strong communication and collaboration skills to work effectively in cross-functional teams.
  • Familiarity with high-volume manufacturing environments and technology transfer processes.
  • Experience with statistical process control (SPC), design of experiments (DOE), and other quality improvement methods.

Your expertise and dedication could drive transformative innovation at Intel, applying your skills to shape the future of semiconductor technology. Take the next step in your career and join us in making a measurable impact.

Job Type:

Experienced Hire

Shift:

Shift 1 (Taiwan)

Primary Location:

Taiwan, Taipei

Additional Locations:

Taiwan, Hsinchu

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
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